Medical equipment Rigid-Flex PCB Manufacturers

We normally believe that one's character decides products' quality, the details decides products' high-quality ,while using the REALISTIC,EFFICIENT AND INNOVATIVE staff spirit for Medical equipment Rigid-Flex PCB,100-layer Rigid-Flex PCB,Wearable Rigid-Flex PCB,Military Rigid-Flex Backplane, We have now confident that we can easily offer the premium quality products and solutions at resonable price, good after-sales services into the buyers. And we're going to produce a dazzling future.
Medical equipment Rigid-Flex PCB, Based on our automatic production line, steady material purchase channel and quick subcontract systems have been built in mainland China to meet customer's wider and higher requirement in recent years. We have been looking forward to cooperating with more clients worldwide for common development and mutual benefit!Your trust and approval are the best reward for our efforts. Keeping honest, innovative and efficient, we sincerely expect that we can be business partners to create our brilliant future!

Hot Products

  • XC7Z020-1CLG400I

    XC7Z020-1CLG400I

    ​The XC7Z020-1CLG400I embedded system on chip (SoC) adopts a dual core ARM Cortex-A9 processor configuration, integrating 7 series programmable logic (up to 6.6M logic units and 12.5Gb/s transceiver), providing highly differentiated design for various embedded applications.
  • 10CL025YU256C8G

    10CL025YU256C8G

    10CL025YU256C8G is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU11P-3FLGC2104E

    XCVU11P-3FLGC2104E

    ​XCVU11P-3FLGC2104E is an FPGA (Field Programmable Gate Array) chip launched by Xilinx, belonging to the Virtex UltraScale+series. This chip has been widely used in fields such as data centers, network communication, video and image processing due to its high performance, low power consumption, and flexibility.
  • XC6SLX45-3CSG324I

    XC6SLX45-3CSG324I

    ​The XC6SLX45-3CSG324I platform devices support up to 150K logic density, 4.8Mb memory, integrated storage controllers, and easy-to-use high-performance system IPs (such as DSP modules), while adopting innovative open standard based configurations.
  • XC3S200A-4FTG256I

    XC3S200A-4FTG256I

    XC3S200A-4FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • CY7C2665KV18-450BZI

    CY7C2665KV18-450BZI

    CY7C2665KV18-450BZI integrated circuit, is the memory chip of CYPRESS, storage capacity: 144Mbit, power: 450MHZ, package: 165-FBGA

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