Ro3003 PCB Manufacturers

Our company puts emphasis on the management, the introduction of talented personnel, and the construction of staff building, trying hard to improve the quality and liability consciousness of staff members. Our company successfully attained IS9001 Certification and European CE Certification of Ro3003 PCB,Ro4835LoPro PCB,77G millimeter wave PCB,RT5880 PCB,TSM-DS3 PCB, Trust us and you will gain a lot more. You should truly feel totally free to make contact with us for additional data, we assure you of our greatest notice at all times.
Ro3003 PCB, Our products and solutions are exported worldwide. Our customers are always satisfied with our reliable quality, customer-oriented services and competitive prices. Our mission is "to continue to earn your loyalty by dedicating our efforts to the constant improvement of our solutions and services in order to ensure the satisfaction of our end-users, customers, employees, suppliers and the worldwide communities in which we cooperate".

Hot Products

  • EM-890 PCB

    EM-890 PCB

    BGA is a small package on a pcb circuit board, and BGA is a packaging method in which an integrated circuit uses an organic carrier board.The following is about 8 layers EM-890 PCB, I hope to help you better understand 8 layers EM-890 PCB.
  • 10M25DAF484C8G

    10M25DAF484C8G

    ​10M25DAF484C8G is an FPGA (Field Programmable Gate Array) product produced by Altera (now acquired by Intel). This FPGA adopts FBGA484 package and has the following key features: Packaging form: FBGA484 packaging is used, which is a surface mount technology suitable for high-density integrated circuits. Working temperature range: The minimum working temperature is -40 ° C, and the maximum working temperature is 130 ° C, suitable for applications under various environmental conditions.
  • EP1SGX25DF1020C5N

    EP1SGX25DF1020C5N

    EP1SGX25DF1020C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU7P-L2FLVC2104E

    XCVU7P-L2FLVC2104E

    ​XCVU7P-L2FLVC2104E is an FPGA (Field Programmable Gate Array) produced by AMD/Xilinx. This FPGA belongs to Kintex ® The UltraScale+series offers multiple power options to achieve the best balance between required system performance and extremely low power consumption. It has the following characteristics:
  • XCKU060-2FFVA1517I

    XCKU060-2FFVA1517I

    ​XCKU060-2FFVA1517I has been optimized for system performance and integration under the 20nm process, and adopts single chip and next-generation stacked silicon interconnect (SSI) technology. This FPGA is also an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.
  • XC95144XL-10TQG144I

    XC95144XL-10TQG144I

    XC95144XL-10TQG144I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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