XCKU060-2FFVA1517E has been optimized for system performance and integration in a 20nm process, and adopts single-chip and next-generation stacked silicon interconnect (SSI) technology. This FPGA is also an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.
XCKU060-2FFVA1517E has been optimized for system performance and integration in a 20nm process, and adopts single-chip and next-generation stacked silicon interconnect (SSI) technology. This FPGA is also an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.
Functional Features
Improve system performance
6.3 TeraMAC's DSP Computing Performance
The system level performance per watt is more than twice that of Kintex-7 FPGA
Supports 16G and 28G backplane transceivers
Medium speed 2666 Mb/s DDR4
Total power consumption reduction
Compared to the previous generation product, power consumption can be reduced by up to 40%
Implementing fine-grained clock gating similar to ASIC clock functionality through UltraScale devices
Enhanced system logic unit encapsulation reduces dynamic power consumption
Accelerate design efficiency
Script and Virtex ® UltraScale device compatibility for scalability
With Vivado ® The design suite is optimized together to quickly complete the design
