PCB manufacturing Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XC7Z010-1CLG400C

    XC7Z010-1CLG400C

    XC7Z010-1CLG400C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC5VLX110T-1FFG1136C

    XC5VLX110T-1FFG1136C

    XC5VLX110T-1FFG1136C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU3P-2FFVA676I

    XCKU3P-2FFVA676I

    ​XCKU3P-2FFVA676I is an FPGA (Field Programmable Gate Array) device produced by Xilinx, belonging to the Kintex UltraScale+series. This FPGA has the following features and specifications
  • XCZU11EG-3FFVC1760E

    XCZU11EG-3FFVC1760E

    XCZU11EG-3FFVC1760E integrates feature rich 64 bit quad core or dual core Arm in a single device ® Cortex-A53 processing system and programmable logic UltraScale architecture based on dual core Arm Cortex-R5F. In addition, it also includes on-chip memory, multi port external memory interfaces, and rich peripheral connection interfaces.
  • XC7K160T-3FFG676E

    XC7K160T-3FFG676E

    XC7K160T-3FFG676E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX25-3FTG256I

    XC6SLX25-3FTG256I

    XC6SLX25-3FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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