TMM6 High Frequency PCB Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • Multilayer layers HDI PCB

    Multilayer layers HDI PCB

    Multilayer layers HDI PCB, press 3-6 layers first, then add 2 and 7 layers, and finally add 1 to 8 layers, a total of three times.The following is about 8 layers 3Step HDI, I hope to help you better understand 8 layers 3Step HDI.
  • XCKU035-1FBVA676C

    XCKU035-1FBVA676C

    XCKU035-1FBVA676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU7P-2FLVA2104I

    XCVU7P-2FLVA2104I

    The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.
  • MT47H64M8SH-25E:H

    MT47H64M8SH-25E:H

    ​MT47H64M8SH-25E:H is a type of synchronous dynamic random-access memory (SDRAM) chip produced by Micron Technology. It has a capacity of 512 megabytes (MB) and a maximum clock speed of 200 megahertz (MHz). The chip operates at a voltage of 2.5
  • Medical ultrasound probe FPC

    Medical ultrasound probe FPC

    Medical ultrasound probes are devices that transmit and receive ultrasound during the ultrasound testing process. The performance of the probe directly affects the characteristics of ultrasonic waves and the detection performance of ultrasonic waves.The following is about Medical ultrasound probe FPC related, I hope to help you better understand Medical ultrasound probe FPC.
  • XCVU19P-1FSVA3824E

    XCVU19P-1FSVA3824E

    ​XCVU19P-1FSVA3824E is an FPGA (Field Programmable Gate Array) product produced by Xilinx, belonging to the Virtex UltraScale+series. This FPGA has the following key features and specifications:

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