SH260 polyimide PCB Manufacturers

With this motto in mind, we've turn into one of quite possibly the most technologically innovative, cost-efficient, and price-competitive manufacturers for SH260 polyimide PCB,ST115D high thermal conductivity PCB,12-layer VT-901 polyimide PCB, "Quality", "honesty" and "service" is our principle. Our loyalty and commitments remain respectfully at your support. Speak to Us Today For even more facts, get in touch with us now.
SH260 polyimide PCB, There are advanced producing & processing equipment and skilled workers to ensure the merchandise with high quality. We now have found an excellent before-sale, sale, after-sale service to ensure the customers that could rest assured to make orders. Until now our goods are now moving on fast and very popular in South America, East Asia, the Middle east, Africa, etc.

Hot Products

  • XC3S1500-4FGG676I

    XC3S1500-4FGG676I

    XC3S1500-4FGG676I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • NB3N5573DTG

    NB3N5573DTG

    NB3N5573DTG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU11P-L2FLGB2104E

    XCVU11P-L2FLGB2104E

    ​XCVU11P-L2FLGB2104E is an FPGA (Field Programmable Gate Array) chip launched by Xilinx, belonging to the Virtex UltraScale series, using 20nm process technology. With its high performance and high integration, this chip provides powerful processing capabilities for various applications.
  • XC4VLX60-10FF668C

    XC4VLX60-10FF668C

    XC4VLX60-10FF668C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5AGTMD3G3F31I3G

    5AGTMD3G3F31I3G

    5AGTMD3G3F31I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX100T-3CSG484C

    XC6SLX100T-3CSG484C

    XC6SLX100T-3CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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