Products
Home > Products > S1150G PCB

S1150G PCB Manufacturers

We have been also specializing in improving the things administration and QC system to ensure that we could preserve terrific gain within the fiercely-competitive company for S1150G PCB,Halogen-free PCB,S2155G PCB,S1151G PCB,S1170G PCB, We welcome new and old customers to contact us by phone or send us inquiries by mail for future business relationships and achieving mutual success.
S1150G PCB, Why we can do these? Because: A, We are honest and reliable. Our products have high quality, attractive price, sufficient supply capacity and perfect service. B, Our geographical position has a big advantage . C, Various types: Welcome your inquiry, It will be highly appreciated.

Related Products

Hot Products

  • Megtron6 step PCB

    Megtron6 step PCB

    In addition to the requirement for uniform thickness of the plating layer for drilling, backplane designers generally have different requirements for the uniformity of copper on the surface of the outer layer. Some designs etch few signal lines on the outer layer. The following is about Megtron6 step PCB related, I hope to help you better understand Megtron6 step PCB.
  • RT5880

    RT5880

    As an industry leader in the field of electronic materials, Rogers RT5880 material has been providing advanced materials with high performance and high reliability in the fields of consumer electronics, power electronics and communication infrastructure.
  • EP2AGX95EF29C5N

    EP2AGX95EF29C5N

    EP2AGX95EF29C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EPM1270F256C5N

    EPM1270F256C5N

    EPM1270F256C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 10M16DAF256C8G

    10M16DAF256C8G

    ​10M16DAF256C8G is an FPGA (Field Programmable Logic Device) produced by Intel/Altera, belonging to the MAX 10 series. This FPGA has the following features and specifications: Number of logical elements: It has 16000 logical elements, including 1000 LAB (logical array blocks). Number of input/output terminals: Provide 178 input/output terminals.
  • XCVU7P-2FLVA2104I

    XCVU7P-2FLVA2104I

    The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.
  • Related Blog
  • Reviews

  • The origin of 50 ohms in impedance matching

    For traces with a certain width, three main factors will affect the impedance of PCB traces. First of all, the EMI (electromagnetic interference) of the near field of the PCB trace is proportional to the height of the trace from the reference plane. The lower the height, the smaller the radiation. Secondly, the crosstalk will change significantly with the height of the trace. If the height is reduced by half, the crosstalk will be reduced to nearly a quarter.

  • HDI board application

    HDI is widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured by the build-up method.

  • What is the future development prospect of chips in China

    Chips are also known as integrated circuits and microcircuits. Mobile phone chips are an important branch of them. All functions of smart phones currently used by everyone depend on mobile phone chips. Mobile phones without chips are even worse than bricks. It can be seen that mobile phones rely heavily on chips. Chip technology directly affects the future development of mobile communications.

  • Printed circuit boards can be seen everywhere. Do you know how difficult it is to make them

    In the production of electronic products, there will be a production process of printed circuit board. Printed circuit boards are used in electronic products in all industries. It is the carrier of electronic schematic diagram that can realize the design function and turn the design into physical products

  • What is semiconductor?

    The semiconductor industry is one of the key industries supported by the state and one of the most critical "bottleneck" industries. What is semiconductor?

  • Precautions for the use of high-speed board plates you must know

    With the rapid development of electronic design and communication fields and the application of cloud computing, products have higher and higher requirements for data volume, and data transmission rates are getting faster and faster. At the same time, the performance of high-speed plates that carry data transmission is also required to be higher and higher.So what should be paid attention to when using high-speed plates?

Send Inquiry