16-layer EM-370 PCB Manufacturers

We believe in: Innovation is our soul and spirit. Quality is our life. Customer need is our God for 16-layer EM-370 PCB,megtron4 high speed PCB,EM-370D high TG PCB,8MM Thick Megtron4 PCB,EM-370 PCB, Should additional details be required, please call us anytime!
16-layer EM-370 PCB, Our company insists on the principle of "Quality First, Sustainable Development", and takes "Honest Business, Mutual Benefits" as our developable goal. All members sincerely thank all old and new customers' support. We'll keep working hard and offering you the highest-quality goods and service.

Hot Products

  • 10M08DCU324I7G

    10M08DCU324I7G

    ​10M08DCU324I7G is a single-chip, non-volatile, low-cost programmable logic device (PLD) used for integrating the best system components. The highlights of 10M08DCU324I7G include: dual configuration flash memory for internal storage, user flash memory, support for instant boot, integrated analog-to-digital converter (ADC), and support for single-chip Nios II soft core processors. The 10M08DCU324I7G is an ideal solution for system management, I/O expansion, communication control planes, industrial, automotive, and consumer electronics products.
  • XCKU060-1FFVA1517C

    XCKU060-1FFVA1517C

    XCKU060-1FFVA1517C is an advanced field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 59,520 logic cells, 17.2 Mb of distributed RAM, 360 Digital Signal Processing (DSP) slices, and 1122 user input/output pins. It operates on a 0.95V to 1.05V power supply and supports various I/O standards such as LVCMOS, HSTL, and PCI Express.
  • XC6SLX100T-3FGG484I

    XC6SLX100T-3FGG484I

    XC6SLX100T-3FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • High Thermal Conductivity PCB

    High Thermal Conductivity PCB

    The high thermal conductivity FR4 circuit board usually guides the thermal coefficient to be greater than or equal to 1.2, while the thermal conductivity of ST115D reaches 1.5, the performance is good, and the price is moderate. The following is about High Thermal Conductivity PCB related, I hope to help you better understand High Thermal Conductivity PCB.
  • 10AX115U2F45I2SG

    10AX115U2F45I2SG

    ​10AX115U2F45I2SG 0AX115U2F45I2SG is a high-performance FPGA that uses a 20 nm process. The Arria ® 10 GX FPGA supports chip to chip data transfer rates of up to 17.4 Gbps, backplane data transfer rates of up to 12.5 Gbps, and up to 1.15 million equivalent logic units.
  • XCVU125-2FLVB2104I

    XCVU125-2FLVB2104I

    ​XCVU125-2FLVB2104I is a high-performance FPGA chip launched by Xilinx, belonging to the VERSAL series. This chip is manufactured using advanced technology, with a large number of logic components and adaptive logic modules, as well as abundant embedded memory resources

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