EM-370 PCB Manufacturers

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Hot Products

  • ADV7511WBSWZ

    ADV7511WBSWZ

    ADV7511WBSWZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10M50DAF256C8G

    10M50DAF256C8G

    ​10M50DAF256C8G is a MAX 10 series FPGA chip produced by Intel (formerly Altera). The chip has 50000 logic elements and 178 I/O ports, packaged in FBGA-256, with a working voltage range of 1.15V to 1.25V and a working temperature range of 0 ° C to 85 ° C.
  • AD250 PCB

    AD250 PCB

    High-frequency mixed-press material step board manufacturing technology is a circuit board manufacturing technology that has emerged with the rapid development of the communications and telecommunications industries. It is mainly used to break through the high-speed data and high information content that traditional printed circuit boards cannot reach. The bottleneck of transmission. The following is about AD250 PCB related, I hope to help you better understand AD250 PCB.
  • 5CGXFC7D6F27C7N

    5CGXFC7D6F27C7N

    ​5CGXFC7D6F27C7N is a Cyclone V GX series FPGA chip produced by Intel (formerly Altera). The chip is packaged in FBGA-672 and has 149500 logic units and 336 I/O ports, supporting system programmability and reprogramming. Its working power supply voltage range is 1.07V to 1.13V
  • SI9407BDY-T1-E3

    SI9407BDY-T1-E3

    SI9407BDY-T1-E3 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU190-3FLGA2577E

    XCVU190-3FLGA2577E

    ​XCVU190-3FLGA2577E is a high-performance FPGA chip belonging to Xilinx's Virtex UltraScale series. This chip has 2349900 logic units and 568 input/output terminals, manufactured using a 20nm process, and packaged in 2577 pin FCBGA.

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