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The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

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  • HI-3584APQI

    HI-3584APQI

    the HI-3584APQI also features an enhanced ARINC 429 3.3V serial transmitter and dual receivers, providing two receivers each with tag recognition, 32x32 FIFO, and analog line receiver. Each receiver can program up to 16 tags. The independent transmitter also has a 32x32 FIFO function, and the status of all FIFOs can be monitored through external status pins or by querying the status register of HI-3584
  • BCM65500B1IFSBR

    BCM65500B1IFSBR

    BCM65500B1IFSBR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • RO3003 PCB

    RO3003 PCB

    The delay per unit inch on the PCB is 0.167ns. However, if there are more vias, more device pins, and more constraints set on the network cable, the delay will increase. Generally, the signal rise time of high-speed logic devices is about 0.2ns. If there are GaAs chips on the board, the maximum wiring length is 7.62mm. The following is about RO3003 PCB related, I hope to help you better understand RO3003 PCB.
  • BCM88270CA1IFSBG

    BCM88270CA1IFSBG

    BCM88270CA1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Buried capacitance PCB

    Buried capacitance PCB

    24-Layer Buried capacitance PCB has a process called burying resistance, which is to put chip resistors and chip capacitors into the inner layer of the PCB board. These chip resistors and capacitors are generally very small, such as 0201, or even smaller 01005. The PCB board produced in this way is the same as a normal PCB board, but a lot of resistors and capacitors are placed in it. For the top layer, the bottom layer saves a lot of space for component placement. The following is about 24 Layer Buried capacitance PCB related, I hope to help you better understand 24 Layer Buried capacitance PCB.
  • Step Gold finger PCB

    Step Gold finger PCB

    The golden finger is composed of many golden yellow conductive contacts. It is called "golden finger" because its surface is gilded and the conductive contacts are arranged like fingers. The step gold finger PCB is actually coated with a layer of gold on the copper clad laminate by a special process, because the gold has strong oxidation resistance and strong conductivity.
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