8mm thick PCB Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • Ro3003 High Frequency PCB

    Ro3003 High Frequency PCB

    With the rapid development of information technology, the trend of high-frequency and high-speed information processing is becoming more and more obvious. The demand for PCBs that can be used at low and high frequencies is increasing. For PCB manufacturers, timely and accurate grasp of market needs and The development trend will make the enterprise invincible. And the finished board has good dimensional stability. The following is about Ro3003 High Frequency PCB related, I hope to help you better understand Ro3003 High Frequency PCB.
  • BCM54340C1KFBG

    BCM54340C1KFBG

    BCM54340C1KFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10M50DAF256C8G

    10M50DAF256C8G

    ​10M50DAF256C8G is a MAX 10 series FPGA chip produced by Intel (formerly Altera). The chip has 50000 logic elements and 178 I/O ports, packaged in FBGA-256, with a working voltage range of 1.15V to 1.25V and a working temperature range of 0 ° C to 85 ° C.
  • 5CEFA9F23I7N

    5CEFA9F23I7N

    5CEFA9F23I7N adopts the FBGA-484 packaging method. This packaging has good heat dissipation performance and reliability, and can effectively protect the internal circuit of the chip.
  • XCVU13P-3FIGD2104E

    XCVU13P-3FIGD2104E

    ​XCVU13P-3FIGD2104E is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, with the following features and specifications: Number of logic elements: There are 3780000 logic elements (LE). Adaptive Logic Module (ALM): Provides 216000 ALMs. Embedded memory: Built in 94.5 Mbit of embedded memory. Number of input/output terminals: Equipped with 752 I/O terminals.
  • 10M04DAU324C8G

    10M04DAU324C8G

    ​10M04DAU324C8G is a MAX 10 series FPGA chip produced by Altera (now under Intel) and belongs to the field programmable gate array (FPGA) category. Here is a detailed introduction about 10M04DAU324C8G

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