40G Optical Module Hard gold PCB Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • IS680 PCB

    IS680 PCB

    IS680 PCB is a kind of high-frequency material developed by Isola company. It uses FR4 and hydrocarbon perfectly, with stable performance, low loss and easy processing
  • copper paste filled hole PCB

    copper paste filled hole PCB

    copper paste filled hole PCB: Bai AE3030 copper pulp is a non-conductive DAO copper paste used for the high-density assembly of printed substrate DU plate and the laying of wires.Due to the characteristics of Zhuan "high Thermal conductivity", "bubble-free", "flat" and so on, the copper paste is most suitable for the design of high reliability Pad on Via, stack on Via and Thermal Via. The copper paste is widely used from aerospace satellite, server, cabling machine, LED backlight and so on.
  • GA100-884AA-A1

    GA100-884AA-A1

    GA100-884AA-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX45-3FGG484C

    XC6SLX45-3FGG484C

    XC6SLX45-3FGG484C is a field-programmable gate array (FPGA) manufactured by Xilinx, a leading company in the development of advanced semiconductor technology. This particular device has a density of 45,408 logic cells, 2.1 Mb of distributed RAM,
  • 5CEBA9F23C7N

    5CEBA9F23C7N

    ​5CEBA9F23C7N is a Cyclone V series FPGA chip produced by Intel (formerly Altera). This chip has high performance and flexibility, suitable for various complex design requirements. Its main features include:
  • EP4S100G5F45I1N

    EP4S100G5F45I1N

    EP4S100G5F45I1N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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