4.25g Optical Module PCB Manufacturers

Our company puts emphasis about the administration, the introduction of talented staff, along with the construction of employees building, seeking hard to boost the standard and liability consciousness of staff members members. Our business successfully attained IS9001 Certification and European CE Certification of 4.25g Optical Module PCB,10G photoelectric PCB,25G photoelectric PCB,Hard gold PCB, We are going to wholeheartedly welcome all clientele during the industry both of those at your home and overseas to cooperate hand in hand, and build a bright potential together.
4.25g Optical Module PCB, Customer's satisfaction is always our quest, creating value for customers is always our duty, a long term mutual-beneficial business relationship is what we've been doing for. We are an absolutely reliable partner for yourself in China. Of course, other services, like consulting, can be offered too.

Hot Products

  • 10-Layer ELIC HDI PCB

    10-Layer ELIC HDI PCB

    10-Layer ELIC HDI PCB In order to avoid confusion, the American IPC Circuit Board Association proposed to call this kind of product technology a common name for HDI (High Density Intrerconnection) technology. If it is directly translated, it will become a high-density interconnection technology. The following is about 10-Layer ELIC HDI PCB related, I hope to help you better understand 10-Layer ELIC HDI PCB.
  • XC7K70T-2FBG676C

    XC7K70T-2FBG676C

    XC7K70T-2FBG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX45-L1CSG324I

    XC6SLX45-L1CSG324I

    XC6SLX45-L1CSG324I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX115N3F40I2LG

    10AX115N3F40I2LG

    10AX115N3F40I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7Z045-1FBG676I

    XC7Z045-1FBG676I

    XC7Z045-1FBG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A50T-L2CSG325E

    XC7A50T-L2CSG325E

    XC7A50T-L2CSG325E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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