10-layer oversized coil PCB Manufacturers

No matter new shopper or old customer, We believe in very long expression and dependable relationship for 10-layer oversized coil PCB,Sensor coil PCB,High Power power supply Coil PCB,10-Layers Coil PCB,10-Layers PCB, We sincerely stay up for hearing from you. Give us a chance to show you our professionalism and passion. We've been sincerely welcome superior mates from numerous circles at dwelling and overseas come to cooperate!
10-layer oversized coil PCB, Now we have sufficient experience in producing solutions according to samples or drawings. We warmly welcome customers from home and abroad to visit our company, and to cooperate with us for a splendid future together.

Hot Products

  • VIA in PAD PCB

    VIA in PAD PCB

    The via-in-PAD is an important part of the multilayer PCB. It not only bears the performance of the main functions of the PCB, but also uses the via-in-PAD to save space.The following is about VIA in PAD PCB related, I hope to help you better understand VIA in PAD PCB.
  • XCZU47DR-L2FFVG1517I

    XCZU47DR-L2FFVG1517I

    XCZU47DR-L2FFVG1517I Xilinx XC7A100T-2FGG676I Can achieve higher cost-effectiveness in multiple aspects, including logic, signal processing, embedded memory, LVDS I/O, memory interfaces, and transceivers. Artix-7 FPGAs are perfect for cost sensitive applications that require high-end functionality.
  • XC6SLX9-2CPG196I

    XC6SLX9-2CPG196I

    ​XC6SLX9-2CPG196I is a high-performance FPGA chip produced by Xilinx. This chip has the following characteristics and specifications:
  • XCVU9P-2FLGB2104E

    XCVU9P-2FLGB2104E

    XCVU9P-2FLGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 2.5 million logic cells, 29.5 Mb of block RAM, and 3240 digital signal processing (DSP) slices, making it ideal for high-performance applications such as high-speed networking, wireless communication, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The device has a maximum operating frequency of up to 1.2 GHz. The device comes in a flip-chip BGA (FLGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU9P-2FLGB2104E is commonly used in advanced systems such as data center acceleration, machine learning, and high-performance computing. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.
  • XCZU67DR-2FFVE1156I

    XCZU67DR-2FFVE1156I

    XCZU67DR-2FFVE1156I is one of the Zynq UltraScale+RFSoC series products produced by AMD/Xilinx
  • XC7Z035-2FFG676I

    XC7Z035-2FFG676I

    XC7Z035-2FFG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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