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We also offer you product sourcing and flight consolidation expert services. We've our personal manufacturing unit and sourcing business. We can offer you virtually every variety of merchandise associated to our item range for 6mm thick PCB,Super thick PCB,8mm thick PCB,7mm thick PCB,10mm thick PCB, We warmly welcome good friends from all walks of life to cooperate with us.
6mm thick PCB, Our company absorbs new ideas, strict quality control, a full range of service tracking, and adhere to make high-quality products. Our business aims to "honest and trustworthy, favorable price, customer first", so we won the trust of the majority of customers! If you are interested in our items and services, remember to do not hesitate to contact us!

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  • XC7VX690T-1FFG1927C

    XC7VX690T-1FFG1927C

    XC7VX690T-1FFG1927C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU23P-3FSVJ1760I

    XCVU23P-3FSVJ1760I

    XCVU23P-3FSVJ1760I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX1140T-2FLG1926C

    XC7VX1140T-2FLG1926C

    XC7VX1140T-2FLG1926C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU5P-2FFVA676I

    XCKU5P-2FFVA676I

    XCKU5P-2FFVA676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S500E-4FTG256C

    XC3S500E-4FTG256C

    XC3S500E-4FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU065-2FFVC1517I

    XCVU065-2FFVC1517I

    ​The XCVU065-2FFVC1517I device provides optimal performance and integration at 20nm, including serial I/O bandwidth and logic capacity. As the only high-end FPGA in the 20nm process node industry, this series is suitable for applications ranging from 400G networks to large-scale ASIC prototype design/simulation.
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    The semiconductor industry is a high-tech industry that involves the research and development, manufacturing, and application of semiconductor materials. Semiconductors are a special type of material with conductive properties that lie between conductors and insulators. Semiconductor materials achieve the functionality of electronic devices by controlling the flow of current.

  • The competition of printed circuit board is fierce, and the high-end field has become a new focus

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    In 1936, Austrian Paul Eisler first used printed circuit board in radio. In 1943, Americans mostly applied this technology to military radios. In 1948, the United States officially recognized that this invention can be used for commercial purposes. Since the mid-1950s, printed circuit boards have been widely used.

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    The advantages of heavy copper PCB make it the top priority for the development of high-power circuits. The heavy copper concentration can handle high power and high heat, which is why high-power circuits have been developed using this technology. Such circuits cannot be developed with low-copper concentration PCBs because they cannot withstand the huge thermal stresses caused by high currents and flowing currents.

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