Products
Home > Products > 6mm thick PCB

6mm thick PCB Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Related Products

Hot Products

  • XCZU19EG-2FFVC1760I

    XCZU19EG-2FFVC1760I

    ​XCZU19EG-2FFVC1760I Zynq™ UltraScale+ ™ MPSoC (EG) devices not only provide scalability for 64 bit processors, but also combine real-time control with software and hardware engines, supporting graphics, video, waveform, and packet processing
  • XC7A50T-2FTG256C

    XC7A50T-2FTG256C

    ​The Xilinx XC7A50T-2FTG256C Artix ® -7 FPGA can achieve higher cost-effectiveness in multiple aspects, including logic, signal processing, embedded memory, LVDS I/O, memory interfaces, and transceivers. Artix-7 FPGA is highly suitable for cost sensitive applications that require high-end functionality.
  • XC7K325T-2FFG900I

    XC7K325T-2FFG900I

    ​XC7K325T-2FFG900I is used to connect to the host system. The 7 series devices utilize Xilinx's unified architecture to protect IP investments and can easily migrate 6 series designs. The unified architecture has universal components, including logic structure, Block RAM, DSP, clock, analog mixed signal (AMS), and fast target changing within the 7 series. The Kindex-7 FPGA architecture greatly shortens development time, allowing designers to focus on product differentiation and new projects for migration.
  • XCZU2EG-2SFVC784E

    XCZU2EG-2SFVC784E

    XCZU2EG-2SFVC784E is a SoC FPGA manufactured by AMD/Xilinx. This FPGA combines ARM Cortex A53, ARM Cortex R5 processors, and ARM Mali-400 MP2 graphics processor
  • XCZU49DR-2FFVF1760I

    XCZU49DR-2FFVF1760I

    ​XCZU49DR-2FFVF1760I is a powerful and high-performance SoC FPGA chip. It has the following characteristics and advantages:
  • XCVU7P-1FFVA2104I

    XCVU7P-1FFVA2104I

    XCVU7P-1FFVA2104I I did not directly find a detailed introduction for the specific model of XCVU7P-1FFVA2104I. However, it can be inferred from the search results that XCVU7P-1FFVA2104I is likely an FPGA (Field Programmable Gate Array)
  • Related Blog
  • Reviews

  • What characteristics do semiconductor materials possess

    Semiconductor materials refer to materials with special electrical properties in electronics and quantum mechanics, including silicon, germanium, silicon nitride, gallium selenide, etc. The special properties of these materials enable them to be used as materials in electronic devices, such as transistors, diodes, solar cells, etc.

  • Why HDI PCB needs to be browned and what is its function？

    We all know that there are many procedures for making HDI PCB from the planned feeding to the final step. One of the processes is called browning. Some people may ask what is the role of browning?

  • PCB wiring

    Wiring is the most important process in the entire PCB design.

  • Installation mode of components on PCB printed circuit board

    Our common computer boards and cards are basically epoxy resin glass cloth based double-sided printed circuit boards. One side is the plug-in components, and the other side is the welding surface of the component feet. It can be seen that the welding points are very regular

  • How to install components on PCB printed circuit board

    Our common computer boards are basically epoxy resin glass cloth-based double-sided printed circuit boards, one of which is a plug-in component and the other side is a component foot welding surface. It can be seen that the solder joints are very regular. We call it the pad for the discrete soldering surface of the component feet

  • Main manufacturing technology of Multilayer PCB printed circuit board

    In 1936, Austrian Paul Eisler first used printed circuit board in radio. In 1943, Americans mostly applied this technology to military radios. In 1948, the United States officially recognized that this invention can be used for commercial purposes. Since the mid-1950s, printed circuit boards have been widely used.

Related Search

TU-872 6mm thick PCB

Send Inquiry