goldfinger PCB Manufacturers

We thinks what clients think, the urgency of urgency to act from the interests of a purchaser position of principle, allowing for greater top quality, decrease processing costs, price ranges are much more reasonable, won the new and aged prospects the support and affirmation for goldfinger PCB,ENEPIG PCB,10G optical module PCB, We goal at Ongoing system innovation, management innovation, elite innovation and sector innovation, give full play for the overall advantages, and constantly make improvements to support excellent.
goldfinger PCB, We will continue to devote ourselves to market & product development and build a well-knit service to our customer to create a more prosperous future. Make sure you contact us today to find out how we can work together.

Hot Products

  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • XC7Z010-1CLG400I

    XC7Z010-1CLG400I

    XC7Z010-1CLG400I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5SGXMA9K2H40I2N

    5SGXMA9K2H40I2N

    5SGXMA9K2H40I2N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • STM32L162RDT6

    STM32L162RDT6

    STM32L162RDT6 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX690T-1FFG1927I

    XC7VX690T-1FFG1927I

    XC7VX690T-1FFG1927I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7VX690T-3FFG1930C

    XC7VX690T-3FFG1930C

    XC7VX690T-3FFG1930C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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