10-layer power coil PCB Manufacturers

With our loaded working experience and thoughtful products and services, we've got been acknowledged as a reputable supplier for most international buyers for 10-layer power coil PCB,Transformer heavy copper PCB,12-layer motor coil PCB, Accurate process devices, Advanced Injection Molding Equipment, Equipment assembly line, labs and software progress are our distinguishing feature.
10-layer power coil PCB, Adhering to the principle of "Enterprising and Truth-Seeking, Preciseness and Unity", with technology as the core, our company continues to innovate, dedicated to providing you with the highest cost-effective solutions and meticulous after-sales service. We firmly believe that: we're outstanding as we have been specialized.

Hot Products

  • 8MM Thick PCB

    8MM Thick PCB

    The aperture ratio of PCB is also called the ratio of thickness to diameter, which refers to the thickness of the board / aperture. If the aperture ratio exceeds the standard, the factory will not be able to process it. The limit of the aperture ratio cannot be generalized. For example, via holes, laser blind holes, buried holes, solder mask plug holes, resin plug holes, etc. are different. The aperture ratio of the via hole is 12: 1, which is a good value. The industry limit is currently 30: 1. The following is about 8MM Thick PCB related, I hope to help you better understand 8MM Thick PCB.
  • EP3C55F780I7N

    EP3C55F780I7N

    EP3C55F780I7N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XCVU095-H1FFVC1517E

    XCVU095-H1FFVC1517E

    ​XCVU095-H1FFVC1517E is a high-performance FPGA chip produced by Xilinx. The chip is based on the advanced UltraScale architecture, with 1176000 logic elements and 67200 adaptive logic modules (ALM), providing up to 60.8 Mbit of embedded memory and 560 I/O ports
  • HI-3583APQIF-15

    HI-3583APQIF-15

    HI-3583APQIF-15 Each receiver features label recognition, 32 x 32 FIFO (First-In, First-Out) buffers, and analog line receivers. Up to 16 labels can be programmed for each receiver. The independent transmitter includes a 32 x 32 FIFO and a built-in line driver
  • R-F775 FPC

    R-F775 FPC

    R-f775 FPC is a flexible circuit board made of r-f775 flexible material developed by songdian. It has stable performance, good flexibility and moderate price
  • XCVU7P-1FLVA2104E

    XCVU7P-1FLVA2104E

    ​XCVU7P-1FLVA2104E is an FPGA (Field Programmable Gate Array) product produced by Xilinx Corporation. This FPGA belongs to the Kintex UltraScale+series and has high performance and programmability, making it suitable for applications that require high-performance computing, data processing, network communication, and more. The detailed parameters and specifications of XCVU7P-1FLVA2104E can be obtained through official documentation or authorized distributors to ensure proper selection and use of the product.

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