TU-885 PCB Manufacturers

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Hot Products

  • EP1K30FC256-3N

    EP1K30FC256-3N

    EP1K30FC256-3N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 6-layers 2Step HDI PCB

    6-layers 2Step HDI PCB

    6-layers 2Step HDI PCB Laminate twice. Take an eight-layer circuit board with blind/buried vias as an example. First, laminate layers 2-7, first make elaborate blind/buried vias, and then laminate layer 1 and 8 layers to make well-made vias .The following is about6 layers 2Step HDI, I hope to help you better understand 6 layers 2Step HDI.
  • MT41K128M16JT-125AAT:K

    MT41K128M16JT-125AAT:K

    ​MT41K128M16JT-125AAT:K is a type of dynamic random-access memory (DRAM) module commonly used in computer systems. It has a capacity of 2 GB and a data transfer rate of 1600 megatransfers per second (MT/s).
  • XCVU080-1FFVA2104I

    XCVU080-1FFVA2104I

    ​XCVU080-1FFVA2104I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx. This chip belongs to the Virtex UltraScale series and provides maximum performance and integration, making it particularly suitable for applications that require high performance and large-scale integration. The XCVU080-1FFVA2104I chip adopts a 20nm process node,
  • XA3S1200E-4FTG256Q

    XA3S1200E-4FTG256Q

    XA3S1200E-4FTG256Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 28-Layer 3step HDI PCB

    28-Layer 3step HDI PCB

    28-Layer 3step HDI PCB While electronic design is constantly improving the performance of the whole machine, it is also trying to reduce its size. In small portable products from mobile phones to smart weapons, "small" is a constant pursuit. High-density integration (HDI) technology can make the design of end products more compact while meeting higher standards of electronic performance and efficiency. The following is about 28 Layer 3step HDI Circuit Board related, I hope to help you better understand 28 Layer 3step HDI Circuit Board.

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