TUC Rigid-Flex PCB Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • sensors ceramic PCB

    sensors ceramic PCB

    sensors ceramic PCB are produced by a ceramic material with piezoelectric properties. Piezoelectric ceramics have a peculiar piezoelectric effect. When subjected to a small external force, they can convert mechanical energy into electrical energy, and when alternating voltage is applied, electrical energy can be converted into mechanical energy.The following is about Piezoelectric ceramic sensor, I hope to help you better understand Piezoelectric ceramic sensor.
  • BCM89887A1AFBG

    BCM89887A1AFBG

    BCM89887A1AFBG is typically packaged in a BGA (Ball Grid Array) or similar high-density packaging format. The chip is available through authorized distributors and resellers worldwide. Lead times and pricing may vary depending on market conditions and supplier agreements.
  • EP4SGX230KF40C3N

    EP4SGX230KF40C3N

    EP4SGX230KF40C3N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • RT6002

    RT6002

    RT6002 promotes continuous breakthroughs in reliability, efficiency and performance in the field of materials by providing advanced material technology, applied knowledge and global production and design collaboration.
  • XC7336Q-10PC44C

    XC7336Q-10PC44C

    XC7336Q-10PC44C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S400AN-4FGG400C

    XC3S400AN-4FGG400C

    XC3S400AN-4FGG400C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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