XC7S75-2FGGA676I

XC7S75-2FGGA676I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, manufactured using a 28nm process. This chip has 48000 logic units and 76800 programmable units, providing high-performance digital signal processing and data processing capabilities. It is also equipped with 832 kbit distributed RAM to meet the storage needs of various applications. The working temperature range of XC7S75-2FGGA676I is -40 ° C to+100 ° C, making it suitable for use in various harsh working environments. Its packaging form is SMD/SMT 676 pin FPBGA, which is convenient for surface mount soldering. This chip has been widely used in fields such as industrial control, Internet of Things, 5G technology, cloud computing, consumer electronics, and artificial intelligence due to its high performance, reliability, and flexibility