28-layer PCB Manufacturers

EP4SGX110HF35C3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

XC7K410T-2FFG900l I is a high-performance programmable logic device (FPGA) launched by Xilinx. This FPGA belongs to Xilinx's seventh generation Kintex series and is manufactured using TSMC's 28 nanometer process, with advanced processing capabilities and powerful logic resources

17 layers ultra small size coil PCB--Compared with the module board, the coil board is more portable, small in size and light in weight. It has a coil that can be opened for easy access and a wide frequency range. The circuit pattern is mainly winding, and the circuit board with etched circuit instead of traditional copper wire turns is mainly used in inductive components. It has a series of advantages such as high measurement, high accuracy, good linearity, and simple structure.The following is about 17 layers ultra small size coil board, I hope to help you better understand 17 layers ultra small size coil board.

XA7Z020-1CLG400Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

​XCKU3P-2FFVB676E is a high-performance FPGA (Field Programmable Gate Array) chip launched by Xilinx. This chip belongs to the UltraScale architecture and has excellent cost-effectiveness, performance, and power consumption performance, making it particularly suitable for applications such as packet processing,

The TU-872SLK PCB is a circuit board produced by combining microstrip technology with lamination technology or optical fiber technology.It has a large capacity, and many original parts are directly made on the circuit board, which reduces the space and improves the utilization rate of the circuit board.The following is about TU872SLK PCB related, I hope to help you better understand TU872SLK PCB.