TUC high-speed circuit board Manufacturers

We have now our possess revenue group, design staff, technical crew, QC team and package group. We now have strict excellent regulate procedures for each process. Also, all of our workers are experienced in printing subject for TUC high-speed circuit board,TU-943N high speed PCB,TU-943R high-speed PCB,20 layer Pentium Motherboard PCB,20-layer PCB, we could solve our customer problems asap and do the profit for our customer. For those who need superior provider and excellent , pls choose us , thanks !
TUC high-speed circuit board, We focus on providing service for our clients as a key element in strengthening our long-term relationships. Our continual availability of high grade solutions in combination with our excellent pre-sale and after-sales service ensures strong competitiveness in an increasingly globalized market. We have been willing to cooperate with business friends from at home and abroad and create a great future together.

Hot Products

  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • Ceramic PCB

    Ceramic PCB

    Ceramic PCB substrate is a 96% aluminum oxide ceramic double-sided copper clad substrate, which is mainly used in high-power module power supplies, high-power LED lighting substrates, solar photovoltaic substrates, high-power microwave power devices, which have high thermal conductivity, high pressure resistance, high temperature resistance, solderability resistance.
  • GA100-875GG1-A1

    GA100-875GG1-A1

    GA100-875GG1-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • P5040NXN72QC

    P5040NXN72QC

    P5040NXN72QC is a microchip launched by NXP, operating temperature -40°C~105°C(TA), speed 2.2GHz, supplier device package 1295-FCPBGA(37.5x37.5)
  • AD830ARZ

    AD830ARZ

    AD830ARZ is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A35T-1CSG325C

    XC7A35T-1CSG325C

    ​The XC7A35T-1CSG325C Artix TM -7 device provides a high-performance power architecture, transceiver line speed, DSP processing capability, and AMS integration in a single cost optimized FPGA. Including MicroBlaze ™ Supported by a soft processor and 1066Mb/s DDR3 technology, this series provides maximum value for various cost and power sensitive applications, including software defined radio, machine vision photography, and low-end wireless backhaul.

Send Inquiry