TLP-5A PCB Manufacturers

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Hot Products

  • N7000-1 PCB

    N7000-1 PCB

    N7000-1 PCB is a kind of high temperature resistant polyimide PCB produced by nelco in Singapore. Its main application field is aviation and maritime communication industry. It has high temperature resistance, low temperature resistance, good water absorption and strong stability. It is a high frequency material with BT property and easy to process
  • BCM65230C0IFSBG

    BCM65230C0IFSBG

    BCM65230C0IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU065-2FFVC1517I

    XCVU065-2FFVC1517I

    ​The XCVU065-2FFVC1517I device provides optimal performance and integration at 20nm, including serial I/O bandwidth and logic capacity. As the only high-end FPGA in the 20nm process node industry, this series is suitable for applications ranging from 400G networks to large-scale ASIC prototype design/simulation.
  • XCKU5P-L2FFVB676E

    XCKU5P-L2FFVB676E

    XCKU5P-L2FFVB676E is a high-performance FPGA (Field Programmable Gate Array) product launched by Xilinx. This FPGA belongs to the Kintex UltraScale+series and has the following features and specifications
  • BCM56867A1IFSBG

    BCM56867A1IFSBG

    BCM56867A1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7Z015-1CLG485I

    XC7Z015-1CLG485I

    ​XC7Z015-1CLG485I is a programmable logic device FPGA produced by Xilinx, belonging to the Zynq-7000 series. This device combines the flexibility and scalability of FPGA, while providing high performance, low power consumption, and ease of use, typically associated with ASIC and ASSP performance

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