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"Control the quality by the details, show the strength by quality". Our company has strived to establish a highly efficient and stable staff team and explored an effective quality control process for High Tg PCB,S1000-2M PCB,S1000-2 PCB,S1000H PCB,S1190 PCB, We sincerely welcome buddies to negotiate business enterprise and start cooperation with us. We hope to join hands with good friends in different industries to produce a brilliant long term.
High Tg PCB, Our tenet is "integrity first, quality best". We now have confidence in providing you with excellent service and ideal goods. We sincerely hope we can establish win-win business cooperation with you in the future!

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    XC6SLX150-3FGG676I

    ​XC6SLX150-3FGG676I Packaging BGA integrated circuit chips, IC electronic components, inquiry and order placement
  • 8-layer rigid-Flex PCB

    8-layer rigid-Flex PCB

    8-layer rigid-Flex PCB has the characteristics of bending and folding, so it can be used to make customized circuit, maximize the indoor available space, use this point, reduce the space occupied by the whole system, the overall cost of rigid Flex PCB will be relatively high, but with the continuous maturity and development of the industry, the overall cost will continue to reduce, so it will be more cost-effective and competitive power.
  • MT41K256M16TW-107AAT:P

    MT41K256M16TW-107AAT:P

    ​MT41K256M16TW-107AAT:P is a type of DDR3 Synchronous Dynamic Random-Access Memory (SDRAM) module. It is commonly used in computer systems and other electronic devices for high-speed data storage and access.
  • XC7K410T-3FBG676E

    XC7K410T-3FBG676E

    XC7K410T-3FBG676E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC9572-10TQG100C

    XC9572-10TQG100C

    XC9572-10TQG100C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
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