High-speed PCB Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

  • XCKU035-1FFVA1156C

    XCKU035-1FFVA1156C

    ​XCKU035-1FFVA1156C is an FPGA chip launched by Xilinx and belongs to the Kintex UltraScale series. This chip adopts a 16 nanometer process and is packaged in FCBGA with 318150 logic units and 1156 pins, making it widely used in high-performance computing and communication applications
  • 6-layer Rigid-Flex PCB

    6-layer Rigid-Flex PCB

    The 6-layer Rigid-Flex PCB has the characteristics of FPC and PCB at the same time. Therefore, it can be used in some products with special requirements, including flexible areas and rigid areas. It is of great help to save the internal space of products, reduce the volume of finished products and improve the performance of products.
  • XC2C64A-7QFG48C

    XC2C64A-7QFG48C

    XC2C64A-7QFG48C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX45-2CSG484I

    XC6SLX45-2CSG484I

    XC6SLX45-2CSG484I has 43661 logic components, 2.04 Mbit embedded memory, minimum operating temperature bit -40 C, maximum operating temperature bit+100 C. Provide industry-leading connectivity features such as high logic pin ratio, small-sized packaging, MicroBlaze? Soft processors, and various supported I/O protocols. It is an ideal choice for advanced bridging applications in consumer products, automotive information and entertainment systems, and industrial automation applications
  • BCM56867A1IFSBG

    BCM56867A1IFSBG

    BCM56867A1IFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S200-5PQG208C

    XC2S200-5PQG208C

    XC2S200-5PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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