TU-933 High-speed PCB Manufacturers

We can constantly satisfy our respected customers with our good high quality, good price tag and good support due to we have been additional specialist and extra hard-working and do it in cost-effective way for TU-933 High-speed PCB,TU-943N High-speed PCB,TU-865 PCB,TU-872SLK PCB,TU-1300E High-speed PCB, First company, we understand each other. Further more company, the trust is getting there. Our enterprise normally at your provider anytime.
TU-933 High-speed PCB, In order to meet the increasing requirement of customers both home and aboard, we'll keep carrying forward the enterprise spirit of "Quality, Creativity, Efficiency and Credit" and strive to top the current trend and lead fashion. We warmly welcome you to visit our company and make cooperation.

Hot Products

  • XCKU15P-L2FFVE1517E

    XCKU15P-L2FFVE1517E

    XCKU15P-L2FFVE1517E is a Virtex UltraScale+ FPGA chip from Xilinx, a leading provider of programmable logic solutions. This chip is part of Xilinx's high-performance Virtex UltraScale+ series and features 15 million logic cells and 3,840 DSP slices.
  • XCZU2CG-L1SBVA484I

    XCZU2CG-L1SBVA484I

    XCZU2CG-L1SBVA484I ​The device not only provides scalability for 64 bit processors, but also combines real-time control with software and hardware engines to support graphics, video, waveform, and packet processing. The XCZU2CG-L1SBVA484I (CG) device adopts dual core Cortex technology ™- A53 and dual core Cortex ™- A heterogeneous processing system composed of R5 real-time processing units. This device is the best choice for industrial motor control and sensor fusion
  • 8 Layer Robot HDI PCB

    8 Layer Robot HDI PCB

    HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and direct laser drilling are used. The following is about 8 Layer Robot HDI PCB related, I hope to help you better understand 8 Layer Robot HDI PCB.
  • XC3S700A-4FTG256C

    XC3S700A-4FTG256C

    XC3S700A-4FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 10AX066H3F34I2LG

    10AX066H3F34I2LG

    10AX066H3F34I2LG is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC6SLX75T-2CSG484C

    XC6SLX75T-2CSG484C

    XC6SLX75T-2CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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