IT8350G high-speed PCB Manufacturers

XC7A50T-2FGG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

XCZU7EV-2FFVC1156I is a high-performance SoC FPGA chip launched by Xilinx. It adopts a 20 nanometer process and integrates multiple functional units such as Quad ARM Cortex-A53 MPCore, Dual ARM Cortex-R5, and ARM Mali-400 MP2, providing rich hardware resources

LTM4615EV#PBF is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

XC7Z045-L2FFG676I These products integrate rich functionality based on ARM in a single device ® Cortex? - A9 dual core or single core processing system (PS) and 28 nm Xilinx programmable logic (PL). The ARM Cortex-A9 CPU is the core of PS, which also includes on-chip memory, external memory interfaces, and rich peripheral connection interfaces.

The HI-3210PCIF is a highly integrated data management engine designed specifically for ARINC 429 communication. It features eight ARINC 429 receive channels and four ARINC 429 transmit channels, enabling efficient data transfer between avionics systems

XCVU125-2FLVB1760E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.