26G High-speed PCB Manufacturers

We rely upon strategic thinking, constant modernisation in all segments, technological advances and of course upon our employees that directly participate in our success for 26G High-speed PCB,5G test PCB,5G PCB,6G High-speed PCB,8G High-speed PCB, Our aim is "blazing new ground, Passing Value", in the future, we sincerely invite you to grow up with us and make a bright future together!
26G High-speed PCB, Abiding by our motto of "Hold well the quality and services, Customers Satisfaction", So we present our clients with high quality products and excellent service. Make sure you feel free to contact us for further information.

Hot Products

  • 10-Layer ELIC HDI PCB

    10-Layer ELIC HDI PCB

    10-Layer ELIC HDI PCB In order to avoid confusion, the American IPC Circuit Board Association proposed to call this kind of product technology a common name for HDI (High Density Intrerconnection) technology. If it is directly translated, it will become a high-density interconnection technology. The following is about 10-Layer ELIC HDI PCB related, I hope to help you better understand 10-Layer ELIC HDI PCB.
  • 5CGXFC7D6F27I7N

    5CGXFC7D6F27I7N

    5CGXFC7D6F27I7N is a field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor company. This device features 622,080 logic elements, 27 Mb of RAM, and 1,500 user input/output pins. It operates on a 1.0V to 1.2V power supply and supports various I/O standards such as single-ended I/O,
  • XCVU11P-3FLGC2104E

    XCVU11P-3FLGC2104E

    ​XCVU11P-3FLGC2104E is an FPGA (Field Programmable Gate Array) chip launched by Xilinx, belonging to the Virtex UltraScale+series. This chip has been widely used in fields such as data centers, network communication, video and image processing due to its high performance, low power consumption, and flexibility.
  • XC6SLX9-3CSG324C

    XC6SLX9-3CSG324C

    XC6SLX9-3CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU15P-2FFVA1760I

    XCKU15P-2FFVA1760I

    XCKU15P-2FFVA1760I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Heavy copper PCB

    Heavy copper PCB

    Printed circuit boards are usually bonded with a layer of copper foil on glass epoxy substrate. The thickness of copper foil is usually 18 μ m, 35 μ m, 55 μ m and 70 μ M. The most commonly used copper foil thickness is 35 μ M. When the weight of copper is more than 70UM, it is called heavy copper PCB

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