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We will constantly satisfy our respected customers with our good excellent, superior value and superior assistance due to we're additional experienced and far more hard-working and do it in cost-effective way for 5G PCB,5G test PCB,6G High-speed PCB,8G High-speed PCB,10G High-speed PCB, Welcome globally consumers to speak to us for small business and long-term cooperation. We're going to be your reliable partner and supplier of auto parts and accessories in China.
5G PCB, You can do one-stop shopping here. And customized orders are acceptable. Real business is to get win-win situation, if possible, we would like to deliver more support for customers. Welcome all nice buyers communicate details of solutions and ideas with us!!

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    XC3S400-4FTG256C

    XC3S400-4FTG256C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • N7000-1 PCB

    N7000-1 PCB

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  • BCM88470CB0IFSBG

    BCM88470CB0IFSBG

    ​BCM88470CB0IFSBG is based on the seventh generation Dune scalable switching product line. It can be used to build various network switching solutions with flexible I/O interfaces, such as Ethernet or OTN.
  • XCVU11P-1FLGB2104E

    XCVU11P-1FLGB2104E

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  • EP2SGX30DF780C5N

    EP2SGX30DF780C5N

    EP2SGX30DF780C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
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  • Thermal stress treatment quality of heavy copper PCB

    When designing a circuit, factors such as thermal stress are very important, and engineers should eliminate thermal stress as much as possible. Over time, PCB manufacturing processes have continued to evolve, and various PCB technologies have been invented, such as aluminum PCBs, which can handle thermal stress. It is in the interests of heavy copper PCB designers to minimize the power budget while maintaining the circuit. Performance and environmentally friendly design with heat dissipation performance.

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    the difference between longitude and latitude causes the change of substrate size; Due to the failure to pay attention to the fiber direction during shearing, the shear stress remains in the substrate.

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