ST115G PCB Manufacturers

Our firm sticks to the basic principle of "Quality is the life of your company, and status will be the soul of it" for ST115G PCB,High thermal conductivity PCB,92ML PCB,33N PCB,TC350 PCB, Our mission should be to assist you build long-lasting interactions with the purchasers as a result of the ability of promotional solutions.
ST115G PCB, We only supply quality goods and we believe this is the only way to keep business continue. We can supply custom service too such as Logo, custom size, or custom products and solutions etc that can according to customer's requirement.

Hot Products

  • XCF02SVO20C

    XCF02SVO20C

    XCF02SVO20C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC95144XL-7TQG144I

    XC95144XL-7TQG144I

    XC95144XL-7TQG144I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XA6SLX45-2CSG324Q

    XA6SLX45-2CSG324Q

    XA6SLX45-2CSG324Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU9P-2FLGB2104E

    XCVU9P-2FLGB2104E

    XCVU9P-2FLGB2104E is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. This device features 2.5 million logic cells, 29.5 Mb of block RAM, and 3240 digital signal processing (DSP) slices, making it ideal for high-performance applications such as high-speed networking, wireless communication, and video processing. It operates on a 0.85V to 0.9V power supply and supports various I/O standards such as LVCMOS, LVDS, and PCI Express. The device has a maximum operating frequency of up to 1.2 GHz. The device comes in a flip-chip BGA (FLGB2104E) package with 2104 pins, providing high pin-count connectivity for a variety of applications. XCVU9P-2FLGB2104E is commonly used in advanced systems such as data center acceleration, machine learning, and high-performance computing. The device is known for its high processing capacity, low power consumption, and high-speed performance, making it a top choice for mission-critical applications where reliability and performance are critical.
  • XC7VX485T-1FFG1761I

    XC7VX485T-1FFG1761I

    XC7VX485T-1FFG1761I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM88823CA1KFSBG

    BCM88823CA1KFSBG

    BCM88823CA1KFSBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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