3step HDI Rigid-Flex PCB Manufacturers

The core values of HONTEC are "professional, integrity, quality, innovation" ,adhere to the Prospering Business Based on Science and Technology , the road of scientific management, uphold the "Based on the talent and technology, provides the high quality products and services, to help customers achieve maximum success" business philosophy, has a group of industry experienced high-quality management personnel and technical personnel.Our factory provides multilayer PCB, HDI PCB, heavy copper PCB, ceramic PCB, buried copper coin PCB. Welcome to buy our products from our factory.

Hot Products

XC7A50T-3FGG484E
The XC7A50T-3FGG484E has been optimized for low-power applications that require serial transceivers, high DSP, and logic throughput. Provide the lowest total material cost for high-throughput and cost sensitive applications.
XC7Z035-2FFG900I
XC7Z035-2FFG900I ARM® Cortex ™- The A9 processor is available in dual core (Zynq-7000) and single core (Zynq-7000S) Cortex-A9 configurations, providing integrated 28nm programmable logic per watt, with power consumption and performance levels surpassing discrete processors and FPGA systems
XCKU11P-2FFVA1156I
XCKU11P-2FFVA1156I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
XC6SLX75T-3FGG676C
XC6SLX75T-3FGG676C is a high-end field-programmable gate array (FPGA) developed by Xilinx, a leading semiconductor technology company. It offers a large number of logic cells, distributed memory, and DSP slices, making it suitable for a wide range of applications. This device has 74,880 logic cells, 3.5 Mb of distributed RAM, 180 DSP slices, and 8 clock management tiles.
10AX115H3F34I2SG
10AX115H3F34I2SG adopts a 20 nanometer process, which can provide high performance, supporting chip to chip data transmission rates of up to 17.4 Gbps, backplane data transmission rates of up to 12.5 Gbps, and up to 1.15 million equivalent logic units.
10M08DAF256C8G
10M08DAF256C8G is an FPGA (Field Programmable Gate Array) product produced by Intel. This FPGA belongs to the MAX 10 series and has the following features and specifications

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3step HDI Rigid-Flex PCB Manufacturers

Related Products

Hot Products

XC7A50T-3FGG484E

XC7Z035-2FFG900I

XCKU11P-2FFVA1156I

XC6SLX75T-3FGG676C

10AX115H3F34I2SG

10M08DAF256C8G

When designing a four-layer PCB circuit board, how is the stack-up generally designed?

There is no limit to the production capacity of LCD panels

Circuit thinning drives high-end micro-drill business opportunities

What material is the chip mainly composed of

Semiconductor returned with strength, underestimated value increased with high growth

Precautions for FPC flexible circuit board packaging

Sandra 2024-02-28 13:43:40

Lee 2021-12-02 21:36:41

Irene 2021-02-24 09:33:14

Mag 2020-07-31 22:11:13

Rigoberto Boler 2021-05-19 00:47:00

Jack 2022-09-02 07:21:08

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An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

After the board surface is oxidized, a fluff layer (copper oxide and cuprous oxide) is formed.