28-Layer Rigid-Flex PCB Manufacturers

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Hot Products

  • XCKU095-2FFVB1760I

    XCKU095-2FFVB1760I

    XCKU095-2FFVB1760I has the highest signal processing bandwidth among mid-range next-generation transceivers and can be used for packet processing in 100G networks and data center applications.
  • XC6VLX130T-2FFG1156C

    XC6VLX130T-2FFG1156C

    XC6VLX130T-2FFG1156C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EM-888 7MM Thick PCB

    EM-888 7MM Thick PCB

    EM-888 7MM Thick PCB--As user applications require more and more board layers, alignment between layers becomes very important. Alignment between layers requires tolerance convergence. As the board size changes, this convergence requirement is more demanding. All layout processes are generated in a controlled temperature and humidity environment. The following is about EM888 7MM Thick PCB related, I hope to help you better understand EM888 7MM Thick PCB.
  • XC18V04VQ44C

    XC18V04VQ44C

    XC18V04VQ44C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7K325T-2FF900I

    XC7K325T-2FF900I

    ​XC7K325T-2FF900I FPGA integrated circuit XC7K325T-2F900I 640MHz Kintex-7 FPGA chip 900-FCBGA
  • XCKU035-1FFVA1156C

    XCKU035-1FFVA1156C

    ​XCKU035-1FFVA1156C is an FPGA chip launched by Xilinx and belongs to the Kintex UltraScale series. This chip adopts a 16 nanometer process and is packaged in FCBGA with 318150 logic units and 1156 pins, making it widely used in high-performance computing and communication applications

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