Ro3003 High-frequency PCB Manufacturers

We've been also focusing on improving upon the stuff management and QC program to make sure that we could hold fantastic gain in the fiercely-competitive enterprise for Ro3003 High-frequency PCB,Millimeter wave PCB,77G Millimeter wave PCB,60G Millimeter wave PCB,80G Millimeter wave PCB, Honesty is our principle, professional operation is our work, service is our goal, and customers' satisfaction is our future!
Ro3003 High-frequency PCB, There are advanced producing & processing equipment and skilled workers to ensure the merchandise with high quality. We now have found an excellent before-sale, sale, after-sale service to ensure the customers that could rest assured to make orders. Until now our goods are now moving on fast and very popular in South America, East Asia, the Middle east, Africa, etc.

Hot Products

  • EM-890K HDI PCB

    EM-890K HDI PCB

    HDI boards are generally manufactured using a lamination method. The more laminations, the higher the technical level of the board. Ordinary HDI boards are basically laminated one time. High-level HDI adopts two or more layered technologies. At the same time, advanced PCB technologies such as stacked holes, electroplated holes, and laser direct drilling are used.The following is about EM-890K HDI PCB related, I hope to help you better understand EM-890K HDI PCB.
  • XA7Z020-1CLG484Q

    XA7Z020-1CLG484Q

    XA7Z020-1CLG484Q is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU27P-2FSGA2577E

    XCVU27P-2FSGA2577E

    ​XCVU27P-2FSGA2577E is an FPGA chip produced by Xilinx, belonging to the Virtex UltraScale series. This chip has the characteristics of high performance and low power consumption, and is suitable for various application scenarios, such as data centers, communications, industrial control,
  • XC3S500E-4FGG320C

    XC3S500E-4FGG320C

    XC3S500E-4FGG320C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7Z030-2FBG484I

    XC7Z030-2FBG484I

    XC7Z030-2FBG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX150T-3FGG484I

    XC6SLX150T-3FGG484I

    XC6SLX150T-3FGG484I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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