18 layers copper paste plug hole PCB Manufacturers

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Hot Products

  • Gold finger PCB

    Gold finger PCB

    Gold finger PCB In the extensive use of PCI cable socket gold fingers, gold fingers have been divided into: long and short gold fingers, broken gold fingers, split gold fingers, and gold finger boards. In the process of processing, gold-plated wires need to be pulled. Comparison of conventional gold finger processing processes Simple, long and short gold fingers, the need to strictly control the lead of the gold fingers, requires a second etching to complete.The following is about Gold finger Board related, I hope to help you better understand Gold finger Board.
  • XC7V585T-1FFG1761l

    XC7V585T-1FFG1761l

    XC7V585T-1FFG1761l is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Inlaid Copper Coin PCB

    Inlaid Copper Coin PCB

    The Inlaid Copper Coin PCB is inlaid in the FR4, so as to achieve the function of heat dissipation of a certain chip. Compared with ordinary epoxy resin, the effect is remarkable.
  • XC7VX550T-3FFG1158E

    XC7VX550T-3FFG1158E

    XC7VX550T-3FFG1158E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM53346A0KFSBLG

    BCM53346A0KFSBLG

    BCM53346A0KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCV5UP-2FLVA2104E

    XCV5UP-2FLVA2104E

    XCV5UP-2FLVA2104E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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