EM-888K Rigid-Flex PCB Manufacturers

We also present product or service sourcing and flight consolidation products and services. We have our possess manufacturing facility and sourcing place of work. We can easily supply you with almost every type of product or service connected to our item variety for EM-888K Rigid-Flex PCB,EM-528K Rigid-Flex PCB,EM-528 Rigid-Flex PCB,EM-526 Rigid-Flex PCB,EM-890 Rigid-Flex PCB, We'll make larger endeavours to assist domestic and international prospective buyers, and make the mutual advantage and win-win partnership between us. we are eagerly waiting for your sincerely cooperation.
EM-888K Rigid-Flex PCB, Many products fully conform to the most rigorous of international guidelines and with our first-rate delivery service you will have them delivered at any time and in any place. And because Kayo deals in the entire spectrum of protective equipment, our customers don't have to waste time shopping around.

Hot Products

  • Heavy copper PCB

    Heavy copper PCB

    Printed circuit boards are usually bonded with a layer of copper foil on glass epoxy substrate. The thickness of copper foil is usually 18 μ m, 35 μ m, 55 μ m and 70 μ M. The most commonly used copper foil thickness is 35 μ M. When the weight of copper is more than 70UM, it is called heavy copper PCB
  • XC7Z020-2CLG400I

    XC7Z020-2CLG400I

    XC7Z020-2CLG400I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP3C55U484I7N

    EP3C55U484I7N

    EP3C55U484I7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU5P-2FFVB676I

    XCKU5P-2FFVB676I

    XCKU5P-2FFVB676I is a high-performance FPGA (Field-Programmable Gate Array) chip from Xilinx's Kintex UltraScale+ family. It features 5.3 million logic cells, 113 Mb of UltraRAM and 2,722 DSP slices, and utilizes the 20nm process technology with FinFET+ technology, providing high performance and energy efficiency.
  • XCVU7P-2FLVA2104E

    XCVU7P-2FLVA2104E

    ​XCVU7P-2FLVA2104E is Virtex ™ A FPGA (Field Programmable Gate Array) from the UltraScale+series, designed on 14nm/16nm FinFET nodes to provide the highest performance and integrated functionality. This FPGA adopts AMD's third-generation 3D IC technology
  • XCVU19P-2FSVB3824I

    XCVU19P-2FSVB3824I

    XCVU19P-2FSVB3824I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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