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Hot Products

  • XC7Z030-2SBG485I

    XC7Z030-2SBG485I

    ​The XC7Z030-2SBG485I Zynq-7000 device is equipped with a dual core ARM Cortex-A9 processor, which is compatible with 28nm Artix7 or Kinex based processors ™ The programmable logic integration of 7 can achieve excellent performance to power ratio and maximum design flexibility. The Zynq 7000 device has a logic unit of up to 6.25M and transceivers ranging from 6.6Gb/s to 12.5Gb/s, which can achieve highly differentiated design for many embedded applications such as multi camera driver assistance systems and 4K2K ultra high definition televisions
  • 83CNQ100ASL

    83CNQ100ASL

    83CNQ100ASL is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • A3981KLPTR-T

    A3981KLPTR-T

    A3981KLPTR-T is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S50E-6FTG256C

    XC2S50E-6FTG256C

    XC2S50E-6FTG256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX45T-2CSG324C

    XC6SLX45T-2CSG324C

    XC6SLX45T-2CSG324C is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 43,661 Logic Cells, operates at a speed of up to 400 MHz, and features 1.3 Mb of Block RAM, 180 DSP Slices, and 167 user I/Os.
  • XCVU7P-2FLVA2104I

    XCVU7P-2FLVA2104I

    The XCVU7P-2FLVA2104I device provides the highest performance and integrated functionality on 14nm/16nm FinFET nodes. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements. It also provides a virtual single-chip design environment to provide registered routing lines between chips to achieve operation above 600MHz and provide richer and more flexible clocks.

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