Products
Home > Products > AP9151R Rigid-Flex PCB

AP9151R Rigid-Flex PCB Manufacturers

We rely upon strategic thinking, constant modernisation in all segments, technological advances and of course upon our employees that directly participate within our success for AP9151R Rigid-Flex PCB,Twelve layer Rigid-Flex PCB,Fourteen layer Rigid-Flex PCB,Sixteen layer Rigid-Flex PCB,Eighteen layer Rigid-Flex PCB, For additional information and facts, please speak to us as quickly as possible!
AP9151R Rigid-Flex PCB, We have constructed strong and long co-operation relationship with an enormous quantity of companies within this business overseas. Immediate and specialist after-sale service supplied by our consultant group has happy our buyers. Detailed Info and parameters from the merchandise will probably be sent to you for any thorough acknowledge. Free samples may be delivered and company check out to our corporation. n Portugal for negotiation is constantly welcome. Hope to get inquiries type you and construct a long-term co-operation partnership.

Related Products

Hot Products

  • XQR5VFX130-1CN1752B

    XQR5VFX130-1CN1752B

    XQR5VFX130-1CN1752B is widely used in communication, data center, industrial automation, medical, automotive and other fields. In the field of communication, it is used to realize high-speed data transmission, signal processing and other functions. In the field of data center, it is used to achieve high-speed computing, data storage and other functions; In the field of industrial automation, it is used to achieve real-time control, data processing and other functions; In the medical field, it is used to realize the functions of medical image processing and biological signal analysis. In the automotive field, it is used to achieve autonomous driving, intelligent driving assistance and other functions
  • EM-891K HDI PCB

    EM-891K HDI PCB

    EM-891K HDI PCB is made of EM-891k material with the lowest loss of EMC brand by HONTEC. This material has the advantages of high speed, low loss and better performance.
  • XCVU13P-3FHGA2104E

    XCVU13P-3FHGA2104E

    XCVU13P-3FHGA2104E is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX25-2CSG324C

    XC6SLX25-2CSG324C

    ​XC6SLX25-2CSG324C is a powerful, flexible and programmable FPGA chip with high performance, flexible programmability, rich communication interfaces, support for IP cores, and low power consumption. ‌‌
  • XC7S75-2FGGA676I

    XC7S75-2FGGA676I

    ​XC7S75-2FGGA676I is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, manufactured using a 28nm process. This chip has 48000 logic units and 76800 programmable units, providing high-performance digital signal processing and data processing capabilities.
  • EPM1270F256I5N

    EPM1270F256I5N

    EPM1270F256I5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Related Blog
  • Reviews

  • Development of integrated circuits

    The most advanced integrated circuit is the core of microprocessor or multi-core processor, which can control everything from computer to mobile phone to digital microwave oven. Although the cost of designing and developing a complex

  • What is the future development prospect of chips in China

    With the rapid development of digital technology, electronic products are undergoing tremendous changes, especially in the mobile phone industry. As we all know, chips are the core components of smart phones, and the development of chip industry is related to the development of mobile phones and other electronic products.

  • Classification of electronic components

    Components: products that do not change the molecular composition of raw materials during processing can be called components.

  • The world's top three chip manufacturers

    Under the background of chip shortage, chip is becoming a crucial field in the world. In the chip industry, Samsung and Intel have always been the world's largest IDM giants (integrating design, manufacturing and sealing and testing, basically without relying on others). For a long time, the Iron Throne of global chips was fought back and forth between the two until TSMC rose and the bipolar pattern was completely broken.

  • What is a semiconductor and what is its purpose

    A semiconductor is a substance with a conductivity between that of a conductor and an insulator. It is not very conductive in a pure state, but its conductivity can be adjusted by adding impurities (doping) or changing the temperature. The typical representative of semiconductors is silicon, which is widely used in the manufacturing of electronic components. Semiconductor technology is the cornerstone of modern electronic devices, such as smartphones, computers, digital cameras, etc., all rely on semiconductor chips. In addition, semiconductors are also very important in the energy field, such as semiconductor materials, which are the core of solar cells

  • What is the C chip

    IC chip (integrated circuit) is an integrated circuit formed by putting a large number of microelectronic components (transistors, resistors, capacitors, diodes, etc.) on a plastic base to make a chip. At present, almost all chips can be called IC chips.

Send Inquiry