Sixteen layer Rigid-Flex PCB Manufacturers

The buyer pleasure is our primary concentrate on. We uphold a consistent level of professionalism, excellent, credibility and service for Sixteen layer Rigid-Flex PCB,Twelve layer Rigid-Flex PCB,Fourteen layer Rigid-Flex PCB,Eighteen layer Rigid-Flex PCB,AP8555R Rigid-Flex PCB, We are ready to cooperate with organization pals from at your home and abroad and make a great long term together.
Sixteen layer Rigid-Flex PCB, We aspire to meet the demands of our customers globally. Our range of solutions and services is continuously expanding to meet customers' requirements. We welcome new and old customers from all walks of life to contact us for future business relationships and achieving mutual success!

Hot Products

  • MT41K512M8DA-107IT:P

    MT41K512M8DA-107IT:P

    MT41K512M8DA-107IT:P is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Ro3003 Material

    Ro3003 Material

    Ro3003 Material is a high frequency circuit material filled with PTFE composite material, which is used in commercial microwave and RF applications. The product series aims to provide excellent electrical and mechanical stability at competitive prices. Rogers ro3003 has excellent dielectric constant stability over the entire temperature range, including eliminating the change of dielectric constant when using PTFE glass at room temperature. In addition, the loss coefficient of the ro3003 laminate is as low as 0.0013 to 10 GHz.
  • XC7S75-1FGGA676I

    XC7S75-1FGGA676I

    ​XC7S75-1FGGA676I is a Xilinx chip belonging to the Spartan-7 series, manufactured using 28 nanometer technology. It is a field programmable logic array (FPGA) chip with various excellent features. XC7S75-1FGGA676I is equipped with MicroBlaze ™ A soft processor that can achieve performance of over 200 DMIPs and support DDR3 at 800Mb/s.
  • XC7Z030-2FBG676I

    XC7Z030-2FBG676I

    XC7Z030-2FBG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S1000-4FTG256I

    XC3S1000-4FTG256I

    XC3S1000-4FTG256I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU3P-1FFVB676E

    XCKU3P-1FFVB676E

    XCKU3P-1FFVB676E is a high-performance FPGA (Field Programmable Gate Array) produced by Xilinx in the Kintex UltraScale+series. This FPGA integrates millions of logic units, a large number of high-speed serial transceivers, large capacity block RAM, and advanced DSP units, forming a powerful computing platform that can meet the needs of complex algorithm processing, high-speed data transmission, and large-scale parallel processing

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