24-layer server Buried capacitance PCB Manufacturers

We can constantly satisfy our respected customers with our good high quality, good price tag and good support due to we have been additional specialist and extra hard-working and do it in cost-effective way for 24-layer server Buried capacitance PCB,multilayer Buried resistance PCB,Microphone Buried capacitance PCB,Buried capacitance PCB,24-Layer PCB, First company, we understand each other. Further more company, the trust is getting there. Our enterprise normally at your provider anytime.
24-layer server Buried capacitance PCB, At Existing, our solutions have been exported to more than sixty countries and different regions, such as Southeast Asia, America, Africa, Eastern Europe, Russia, Canada etc. We sincerely hope to establish wide contact with all potential customers both in China and the rest part of the world.

Hot Products

  • HI-8282APJI

    HI-8282APJI

    HI-8282APJI is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7A50T-2CPG236I

    XC7A50T-2CPG236I

    ​The XC7A50T-2CPG236I Artix ® -7 series is optimized for low-power applications that require serial transceivers, high DSP, and logic throughput. Provide the lowest total material cost for high-throughput and cost sensitive applications
  • BCM84328BKFSBLG

    BCM84328BKFSBLG

    BCM84328BKFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2SGX130GF1508C3N

    EP2SGX130GF1508C3N

    EP2SGX130GF1508C3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP2SGX30DF780C5N

    EP2SGX30DF780C5N

    EP2SGX30DF780C5N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • BCM88271CA1KFSBG

    BCM88271CA1KFSBG

    BCM88271CA1KFSBG is available from various distributors and may be subject to pricing fluctuations based on market conditions and supply chain dynamics. Pricing information can be obtained by contacting authorized Broadcom distributors or by visiting their online storefronts.

Send Inquiry