The XC7A50T-2CPG236I Artix ® -7 series is optimized for low-power applications that require serial transceivers, high DSP, and logic throughput. Provide the lowest total material cost for high-throughput and cost sensitive applications
The XC7A50T-2CPG236I Artix ® -7 series is optimized for low-power applications that require serial transceivers, high DSP, and logic throughput. Provide the lowest total material cost for high-throughput and cost sensitive applications.
Product Features
Advanced high-performance FPGA logic is based on true 6-input lookup table (LUT) technology and can be configured as distributed memory.
36 Kb dual port block RAM with built-in FIFO logic for on-chip data buffering.
High performance SelectIO ™ Technology, supporting DDR3 interfaces up to 1866 Mb/s.
High speed serial connection, built-in gigabit transceiver, with speeds ranging from 600 Mb/s to up to 6.6 Gb/s and then to 28.05 Gb/s, providing a special low-power mode optimized for chip to chip interfaces.
User configurable analog interface (XADC), integrated with dual channel 12 bit 1MSPS analog-to-digital converter and on-chip thermal and power sensors.
DSP chip with 25 x 18 multipliers, 48 bit accumulator, and pre ladder diagram for high-performance filtering (including optimized symmetric coefficient filtering).
A powerful clock management chip (CMT) that combines phase-locked loop (PLL) and mixed mode clock manager (MMCM) modules to achieve high precision and low jitter.
Utilizing MicroBlaze ™ Rapid deployment of embedded processing by processors.
PCI Express ® (PCIe) integrated block, suitable for up to x8 Gen3 endpoint and root port designs.
Multiple configuration options, including support for commodity storage, 256 bit AES encryption with HRC/SHA-256 authentication, and built-in SEU detection and correction.
Low cost, wired, bare chip flip chip, and high signal integrity flip chip packaging, making it easy to migrate between products in the same package series. All packages are available in lead-free packaging, with some packages offering lead options.
Designed for high performance and low power consumption, it adopts 28 nanometer, HKMG, HPL process technology, 1.0V core voltage process technology, and a 0.9V core voltage option that can achieve lower power consumption.
