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We have now a specialist, efficiency staff to provide good quality company for our consumer. We normally follow the tenet of customer-oriented, details-focused for Oversized PCB,Large size sensor PCB,Large size PCB,Super big size PCB, should you may have any query or wish to place an initial purchase be sure to never hesitate to contact us.
Oversized PCB, Our company offers the full range from pre-sales to after-sales service, from product development to audit the use of maintenance, based on strong technical strength, superior product performance, reasonable prices and perfect service, we will continue to develop, to provide the high-quality products and services, and promote lasting cooperation with our customers, common development and create a better future.

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    XC7K325T-1FBG900C

    XC7K325T-1FBG900C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM65800IFBGH

    BCM65800IFBGH

    BCM65800IFBGH is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX485T-2FFG1927I

    XC7VX485T-2FFG1927I

    XC7VX485T-2FFG1927I is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 5CEFA4F23C6N

    5CEFA4F23C6N

    5CEFA4F23C6N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC2S100E-6PQG208C

    XC2S100E-6PQG208C

    XC2S100E-6PQG208C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • Mixed HDI PCB of RO4003C

    Mixed HDI PCB of RO4003C

    High-frequency substrates, satellite systems, mobile phone receiving base stations and other communication products must use high-frequency circuit boards, which will inevitably develop rapidly in the next few years, and high-frequency substrates will be in large demand. The following is about Mixed HDI PCB of RO4003C related, I hope to help you better understand Mixed HDI PCB of RO4003C.
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