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  • XC7S50-2CSGA324I

    XC7S50-2CSGA324I

    ​XC7S50-2CSGA324I is an FPGA (Field Programmable Gate Array) launched by AMD/Xilinx, with the following features and specifications: Packaging form: CSPBGA-324 packaging is adopted, which is a surface mount packaging suitable for high-density integrated circuits
  • GA102-895-A1

    GA102-895-A1

    GA102-895-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S400AN-4FG400C

    XC3S400AN-4FG400C

    XC3S400AN-4FG400C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM65500B1IFSBR

    BCM65500B1IFSBR

    BCM65500B1IFSBR is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Gold finger PCB

    Gold finger PCB

    Gold finger PCB In the extensive use of PCI cable socket gold fingers, gold fingers have been divided into: long and short gold fingers, broken gold fingers, split gold fingers, and gold finger boards. In the process of processing, gold-plated wires need to be pulled. Comparison of conventional gold finger processing processes Simple, long and short gold fingers, the need to strictly control the lead of the gold fingers, requires a second etching to complete.The following is about Gold finger Board related, I hope to help you better understand Gold finger Board.
  • XCVU11P-L2FLGB2104E

    XCVU11P-L2FLGB2104E

    ​XCVU11P-L2FLGB2104E is an FPGA (Field Programmable Gate Array) chip launched by Xilinx, belonging to the Virtex UltraScale series, using 20nm process technology. With its high performance and high integration, this chip provides powerful processing capabilities for various applications.
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  • The characteristics of rigid-flex board

    Rigid-flex board is a combination of flexible board and hard board. It is a circuit board formed by combining a thin layered flexible bottom layer with a rigid bottom layer, and then laminating it into a single component.The flexible board is used to replace the cable assembly to complete the highly reliable connection and transmission of power and electrical signals.The product can work stably and reliably for a long time under harsh environments such as high and low temperature, high humidity, vibration, salt spray, and low air pressure. At present, Jonhon Optronic has provided rigid and flexible printed board solutions for aviation, aerospace, ships, weapons and other fields.

  • Development layout of FPC flexible board industry and development trend of domestic and foreign markets

    FPC soft board is an important electronic component. It is also the carrier of electronic components and the electrical connection of electronic components. Through the analysis of the development of FPC soft board in the main regions, the market development trend and the comparative analysis of domestic and foreign markets, this paper gives you a better understanding of FPC Industry.

  • Classification of electronic components

    Components: products that do not change the molecular composition of raw materials during processing can be called components.

  • Precautions for processing covering film of FPC circuit board

    The covering film of FPC circuit board shall be processed by opening the window, but it cannot be processed immediately after being taken out from the cold storage. Especially when the ambient temperature is high and the temperature difference is large, water droplets will condense on the surface.

  • How Does an Integrated Circuit (IC) Work?

    ​An Integrated Circuit (IC) functions by integrating various electronic components onto a semiconductor material, typically silicon.

  • What Are Multilayer Boards?

    Multi-layer PCB is a circuit board composed of more than two layers of electrical layer (copper foil layer) superimposed on each other. The copper layers are bonded together by layers of resin.

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