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    XCVU095-H1FFVC1517E

    ​XCVU095-H1FFVC1517E is a high-performance FPGA chip produced by Xilinx. The chip is based on the advanced UltraScale architecture, with 1176000 logic elements and 67200 adaptive logic modules (ALM), providing up to 60.8 Mbit of embedded memory and 560 I/O ports
  • 10AX115H3F34E2SG

    10AX115H3F34E2SG

    ​10AX115H3F34E2SG is an FPGA (Field Programmable Gate Array) chip, belonging to the Arria 10 GX 1150 series, produced by Intel (formerly Altera Corporation). This chip adopts BGA (Ball Grid Array) packaging form, with 504 I/O interfaces and a packaging form of 1152FBGA
  • Megtron4 High speed PCB

    Megtron4 High speed PCB

    Commonly used high-speed circuit substrates include M4, N4000-13 series, TU872SLK (SP), EM828, S7439, IS I-speed, FR408, FR408HR, EM-888, TU-882, S7038, M6, R04350B, TU872SLK and other high-speed Circuit material. The following is about Megtron4 High speed PCB related, I hope to help you better understand Megtron4 High speed PCB.
  • XC6SLX45-3CSG324I

    XC6SLX45-3CSG324I

    ​The XC6SLX45-3CSG324I platform devices support up to 150K logic density, 4.8Mb memory, integrated storage controllers, and easy-to-use high-performance system IPs (such as DSP modules), while adopting innovative open standard based configurations.
  • XC5VLX50T-1FFG665C

    XC5VLX50T-1FFG665C

    XC5VLX50T-1FFG665C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP4CE22F17I7N

    EP4CE22F17I7N

    ​EP4CE22F17I7N Cyclone IV equipment is available in commercial, industrial, extended industrial, and automotive grades. Cyclone IV E devices provide -6 (fastest), -7, -8, -8L, and -9L speed levels for commercial equipment, -8L speed level for industrial equipment, and -7 speed level for expanding industrial and automotive equipment. The Cyclone IV GX equipment provides -6 (fastest), -7, and -8 speed levels for commercial equipment and -7 speed levels for industrial equipment.
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  • What does semiconductor mean

    Semiconductors are mainly composed of four parts: integrated circuits, optoelectronic devices, discrete devices, and sensors. However, since integrated circuits account for 80% of them, laypeople generally consider integrated circuits as semiconductors. In integrated circuits, they are further divided into microprocessors, memory, logic devices, and analog devices. These small box like things are actually what we commonly refer to as chips.

  • FPC soft board process introduction

    Overview of FPC soft board automatic production line

  • Processing of FPC soft plate and reinforcing plate

    FPC soft board reinforced board processing, FPC soft board reinforced board is unique to flexible circuit board, and its shape and materials are also diverse

  • Polar models enhanced resistance for flexible PCBs

    Now Si8000m and Si9000e also have the new option of XFE cross modeling function, Polar Instruments can provide. More than 98% of PCB manufacturers including Hongtai use Polar.

  • Why should PCB be cleaned?

    When troubleshooting non-functional or poorly performing circuits, engineers can usually run simulations or other analysis tools to consider the circuit from the schematic level.

  • Advantages of HDI PCB

    1. It can reduce the cost of HDI PCB: When the density of PCB increases to more than eight-layer board, it is manufactured with HDI, and its cost will be lower than that of the traditional complex pressing process.

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