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Super Large size PCB, We pursue the management tenet of "Quality is superior, Service is supreme, Reputation is first", and will sincerely create and share success with all clients. We welcome you to contact us for more information and look forward to working with you.

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  • 28OZ Heavy copper PCB

    28OZ Heavy copper PCB

    28OZ Heavy copper PCB Ultra-thick copper multilayer printed boards are generally special types of printed circuit boards. The main features of such printed circuit boards are 4-12 layers, the inner layer copper thickness is greater than 10OZ, and the quality is high. The following is about 28OZ Heavy Copper Board related, I hope to help you better understand 28OZ Heavy Copper Board.
  • EM-888K high-speed PCB

    EM-888K high-speed PCB

    EM-888K high-speed PCB--With the advent of the 5G era, the high-speed and high-frequency characteristics of information transmission in electronic equipment systems have made printed circuit boards face higher integration and greater data transmission tests, which has led to high-frequency high-speed printed circuit boards.The following is about EM-888K high speed PCB related, I hope to help you better understand EM-888K high speed PCB.
  • XC6SLX4-2TQG144C

    XC6SLX4-2TQG144C

    ​XC6SLX4-2TQG144C is a type of FPGA (Field Programmable Gate Array) made by Xilinx. This specific FPGA has 4,608 Logic Cells, operates at a speed of up to 100 MHz, and features 288 Kbit of Block RAM, and 12 DSP Slices.
  • 10CL006YE144I7G

    10CL006YE144I7G

    ​10CL006YE144I7G provides high-density programmable gates, onboard resources, and universal I/O. These resources can meet the requirements of I/O expansion and chip to chip interface.
  • XCZU15EG-2FFVB1156I

    XCZU15EG-2FFVB1156I

    ​The XCZU15EG-2FFVB1156I chip is equipped with 26.2 Mbit embedded memory and 352 input/output terminals. 24 DSP transceiver, capable of stable operation at 2400MT/s. There are also 4 10G SFP+fiber optic interfaces, 4 40G QSFP fiber optic interfaces, 1 USB 3.0 interface, 1 Gigabit network interface, and 1 DP interface. The board has a self-control power on sequence and supports multiple startup mode
  • XCKU060-2FFVA1517E

    XCKU060-2FFVA1517E

    ​XCKU060-2FFVA1517E has been optimized for system performance and integration in a 20nm process, and adopts single-chip and next-generation stacked silicon interconnect (SSI) technology. This FPGA is also an ideal choice for DSP intensive processing required for next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure.
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  • What is an HDI (High Density Interconnect) PCB?

    High Density Interconnection (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology.

  • Semiconductor supporting industry

    The semiconductor support industry mainly includes semiconductor materials, semiconductor equipment and semiconductor software services:

  • What is a semiconductor

    If the substance is distinguished by conductivity, it can be roughly classified into two types

  • How to choose reliable PCB manufacturers for cooperation

    The rise of 5g has driven the innovation, creation and rapid development of the global 3C industry. When more iterations of terminal products become very frequent and rapid, the common development of all core enterprises in the industrial chain becomes very important. 3C products focus on the quality effect and service life. Therefore, the parts and components in the products are very important. As one of the indispensable suppliers in the industrial chain, the buyer is also cautious in choosing.

  • 5G base stations require high-frequency and high-speed circuits, PCB has become a popular product line in the 5G era

    PCB (Printed Circuit Board) is an industry with a relatively low technical threshold. However, 5G communication has the characteristics of high frequency and high speed. Therefore, 5G PCB requires higher technology and the industry threshold is raised; at the same time, the output value is also pulled up.

  • Current status of semiconductor chips in China

    What is the status of Chinese chips On June 9, 2021, at the world semiconductor conference, Wu Hanming, an academician of the Chinese Academy of engineering, pointed out the current situation of China's chips: China still needs 8 SMIC's if it wants to complete the localization and replacement of chips. In short, now China needs 8 SMIC's

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