EM-888 PCB Manufacturers

We emphasize improvement and introduce new goods into the market each year for EM-888 PCB,TG180 PCB,16-layer IC test board,IT180A High TG PCB,EM-A50 PCB, Honesty is our principle, expert operation is our perform, support is our goal, and customers' fulfillment is our future!
EM-888 PCB, Satisfaction and good credit to every customer is our priority. We focus on every detail of order processing for customers till they have received safe and sound products with good logistics service and economical cost. Depending on this, our products and solutions are sold very well in the countries in Africa, the Mid-East and Southeast Asia.

Hot Products

  • BCM8322SBIFBG

    BCM8322SBIFBG

    BCM8322SBIFBG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EM-888 7MM Thick PCB

    EM-888 7MM Thick PCB

    EM-888 7MM Thick PCB--As user applications require more and more board layers, alignment between layers becomes very important. Alignment between layers requires tolerance convergence. As the board size changes, this convergence requirement is more demanding. All layout processes are generated in a controlled temperature and humidity environment. The following is about EM888 7MM Thick PCB related, I hope to help you better understand EM888 7MM Thick PCB.
  • XC2S300E-7FGG456C

    XC2S300E-7FGG456C

    ​XC2S300E-7FGG456C is a product in the Spartan IIE FPGA series produced by Xilinx. It belongs to Field Programmable Gate Arrays (FPGAs), which have high flexibility and configurability, and are suitable for various digital circuit designs. The specific specifications and functions of XC2S300E-7FGG456C may include but are not limited to the following:
  • 5AGTMD3G3F31I3N

    5AGTMD3G3F31I3N

    5AGTMD3G3F31I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • TA990SA-A1

    TA990SA-A1

    TA990SA-A1 is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCKU3P-2FFVD900I

    XCKU3P-2FFVD900I

    ​XCKU3P-2FFVD900I is an electronic component produced by Xilinx, available in BGA packaging with batch numbers 21+and 22+. This component belongs to the FPGA (Field Programmable Gate Array) category and is suitable for various electronic devices and systems.

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