16-layer IC test board Manufacturers

No matter new shopper or old customer, We believe in very long expression and dependable relationship for 16-layer IC test board,TG180 PCB,IT180A High TG PCB,EM-888 PCB,EM-A50 PCB, We sincerely stay up for hearing from you. Give us a chance to show you our professionalism and passion. We've been sincerely welcome superior mates from numerous circles at dwelling and overseas come to cooperate!
16-layer IC test board, High output volume, top quality, timely delivery and your satisfaction are guaranteed. We welcome all inquiries and comments. If you are interested in any of our items or have an OEM order to fulfill, remember to feel free to contact us now. Working with us will save you money and time.

Hot Products

  • XC7VX690T-3FFG1930I

    XC7VX690T-3FFG1930I

    XC7VX690T-3FFG1930I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • TU-883 PCB

    TU-883 PCB

    TU-883 PCB The branch length in high-speed TTL circuits should be less than 1.5 inches. This topology takes up less wiring space and can be terminated with a single resistor match. However, this wiring structure makes the signal reception at different signal receiving ends asynchronous. The following is about 6mm Thick TU883 High speed Backplane related, I hope to help you better understand 6mm Thick TU-883 PCB.
  • ST115G PCB

    ST115G PCB

    ST115G PCB -- with the development of integrated technology and microelectronic packaging technology, the total power density of electronic components is growing, while the physical size of electronic components and electronic equipment is gradually tending to be small and miniaturized, resulting in rapid accumulation of heat, resulting in the increase of heat flux around the integrated devices. Therefore, high temperature environment will affect the electronic components and devices This requires a more efficient thermal control scheme. Therefore, the heat dissipation of electronic components has become a major focus in the current electronic components and electronic equipment manufacturing.
  • XC6SLX16-2CSG324C

    XC6SLX16-2CSG324C

    XC6SLX16-2CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX25-3CSG324I

    XC6SLX25-3CSG324I

    The XC6SLX25-3CSG324I chip is a high-performance FPGA chip based on the famous American chip, mainly used in communication, data transmission, image processing, audio processing and other fields. As a mature chip product, XC6SLX25T-2CSG324I has high flexibility and programmability, which can meet the design requirements of various complex digital circuits.
  • 5CSEBA6U23C7N

    5CSEBA6U23C7N

    5CSEBA6U23C7N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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