SSD Card PCB Manufacturers

Our organization sticks for the principle of "Quality will be the life of your business, and name may be the soul of it" for SSD Card PCB,Solid State Disk PCB,Solid State Drive PCB,ultra-thin BT PCB, Leading the trend of this field is our persistent objective. Supplying first class solutions is our intention. To create a beautiful upcoming, we wish to cooperate with all close friends in the home and overseas. Should you have got any interest in our products and solutions, remember to never wait to call us.
SSD Card PCB, Customer's satisfaction is always our quest, creating value for customers is always our duty, a long term mutual-beneficial business relationship is what we're doing for. We have been an absolutely reliable partner for you personally in China. Of course, other services, like consulting, can be offered too.

Hot Products

  • EPM3128ATC100-10N

    EPM3128ATC100-10N

    EPM3128ATC100-10N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7Z045-2FFG676E

    XC7Z045-2FFG676E

    ​XC7Z045-2FFG676E is a high-performance FPGA chip launched by Xilinx, which has the characteristics of high-speed processing capability, low power consumption, and high integration, and is suitable for various applications in modern communication systems. This chip is based on the ARM Cortex-A9 core
  • EP4S40GH40I2G

    EP4S40GH40I2G

    EP4S40GH40I2G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • 5CEFA9U19I7N

    5CEFA9U19I7N

    ​The 5CEFA9U19I7N Cyclone VE FPGA has been optimized to have the lowest system cost and power consumption, making it suitable for various general-purpose logic and DSP applications.
  • XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E

    XCVU7P-L2FLVB2104E The device provides the highest performance and integrated functionality on the 14nm/16nm FinFET node. AMD's third-generation 3D IC uses stacked silicon interconnect (SSI) technology to break the limitations of Moore's Law and achieve the highest signal processing and serial I/O bandwidth to meet the strictest design requirements
  • XC3SD1800A-4FGG676C

    XC3SD1800A-4FGG676C

    XC3SD1800A-4FGG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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