Carbon ink PCB Manufacturers

We emphasize advancement and introduce new products and solutions into the market each year for Carbon ink PCB,ENEPIG PCB,ENIG PCB,Immersion Silver PCB,Immersion Gold PCB, We look ahead to receiving your enquires quickly and hope to have the chance to get the job done together with you inside the future. Welcome to get a seem at our organization.
Carbon ink PCB, Being the top solutions of our factory, our solutions series have been tested and won us experienced authority certifications. For additional parameters and item list details, be sure to click the button to acquire additional nformation.

Hot Products

  • EP1S20F484C5N

    EP1S20F484C5N

    EP1S20F484C5N is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC3S500E-4FT256C

    XC3S500E-4FT256C

    XC3S500E-4FT256C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 14-layer Rigid - Flex PCB

    14-layer Rigid - Flex PCB

    14-layer Rigid - Flex PCB The rigid-flex board is also called rigid-flex board. With the birth and development of FPC, the new product of rigid-flex circuit board (soft and hard combined board) is gradually being widely used in various occasions.The following is about 14 layer Rigid - Flex PCB related, I hope to help you better understand 14 layer Rigid - Flex PCB.
  • Robot 3step HDI PCB

    Robot 3step HDI PCB

    The heat resistance of the Robot 3step HDI PCB is an important item in the reliability of HDI. The thickness of the Robot 3step HDI Circuit Board becomes thinner and thinner, and the requirements for its heat resistance are getting higher and higher. The advancement of the lead-free process has also increased the requirements for the heat resistance of HDI boards. Since the HDI board is different from the ordinary multilayer through-hole PCB board in terms of layer structure, the heat resistance of the HDI board is the same as that of ordinary multilayer through-hole PCB board is different.
  • XC3S200-4PQG208C

    XC3S200-4PQG208C

    XC3S200-4PQG208C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XCVU11P-2FLGB2104E

    XCVU11P-2FLGB2104E

    ​XCVU11P-2FLGB2104E is an FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Virtex UltraScale series. This chip adopts advanced 20nm process technology, providing excellent performance and integration, especially suitable for high-performance computing, network communication, video processing and other application fields. The main features of XCVU11P-2FLGB2104E chip include:

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