Rogers mixed copper coin PCB Manufacturers

We are also focusing on improving the stuff management and QC system so that we could keep great advantage in the fiercely-competitive business for Rogers mixed copper coin PCB,inlaid copper coin PCB,15OZ heavy copper PCB, Our organization has been devoting that "customer first" and committed to helping clients expand their small business, so that they become the Big Boss !
Rogers mixed copper coin PCB, Our staffs are rich in experience and trained strictly, with professional knowledge, with energy and always respect their customers as the No. 1, and promise to do their best to provide the effective and individual service for customers. The Company pays attention to maintaining and developing the long-term cooperation relationship with the customers. We promise, as your ideal partner, we will develop a bright future and enjoy the satisfying fruit together with you, with persisting zeal, endless energy and forward spirit.

Hot Products

  • 8-layers 3Step HDI PCB

    8-layers 3Step HDI PCB

    8-layers 3Step HDI PCB is pressed 3-6 layers first, then 2 and 7 layers are added, and finally 1 to 8 layers are added, a total of three times.The following is about 8 layers 3Step HDI, I hope to help you better understand 8 layers 3Step HDI.
  • HI-6138PQIF

    HI-6138PQIF

    HI-6138PQIF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM56321B1KFSBG

    BCM56321B1KFSBG

    ​BCM56321B1KFSBG is a high-performance, step-down DC-DC power module developed by Analog Devices, a leading semiconductor technology company. This device features a wide input voltage range of 6V to 36V and a maximum output current of 5A.
  • EM-526 PCB

    EM-526 PCB

    Four layer EM-526 PCB is a kind of multilayer printed circuit board, which has both rigid layer and flexible layer. A typical (four layer) rigid flex printed circuit board has a polyimide core with copper foil on both sides.
  • EP2AGZ350HF40I3N

    EP2AGZ350HF40I3N

    EP2AGZ350HF40I3N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • LT3754IUH#PBF

    LT3754IUH#PBF

    LT3754IUH#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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