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Our company insists all along the quality policy of "product good quality is base of enterprise survival; buyer fulfillment will be the staring point and ending of an company; persistent improvement is eternal pursuit of staff" and also the consistent purpose of "reputation very first, shopper first" for PCBA processing,Industrial control PCBA,PCBA,SMT processing,SMT welding, Customers' benefit and satisfaction are always our biggest goal. Please contact us. Give us a chance, give you a surprise.
PCBA processing, We take measure at any price to attain essentially the most up-to-date gear and procedures. The packing of nominated brand is our a further distinguishing feature. The solutions to assure years of trouble-free service has attracted a great deal customers. The items are obtainable in improved designs and richer variety, they're produced scientifically of purely raw supplies. It accessible in a variety of designs and specs for the selection. The newest forms are much far better than the previous one and they're extremely popular with several clients.

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    ELIC Rigid-Flex PCB

    ELIC Rigid-Flex PCB is the interconnection hole technology in any layer. This technology is the patent process of Matsushita Electric Component in Japan. It is made of short fiber paper of DuPont's "poly aramid" product thermount, which is impregnated with high-function epoxy resin and film. Then it is made of laser hole forming and copper paste, and copper sheet and wire are pressed on both sides to form a conductive and interconnected double-sided plate. Because there is no electroplated copper layer in this technology, the conductor is only made of copper foil, and the thickness of the conductor is the same, which is conducive to the formation of finer wires.
  • XCVU7P-1FLVA2104E

    XCVU7P-1FLVA2104E

    ​XCVU7P-1FLVA2104E is an FPGA (Field Programmable Gate Array) product produced by Xilinx Corporation. This FPGA belongs to the Kintex UltraScale+series and has high performance and programmability, making it suitable for applications that require high-performance computing, data processing, network communication, and more. The detailed parameters and specifications of XCVU7P-1FLVA2104E can be obtained through official documentation or authorized distributors to ensure proper selection and use of the product.
  • XCZU4EG-1SFVC784E

    XCZU4EG-1SFVC784E

    XCZU4EG-1SFVC784E based on Xilinx ® UltraScale MPSoC architecture. This series of products integrates feature rich 64 bit quad core or dual core Arm ® Cortex-A53 and dual core Arm Cortex-R5F processing system (based on Xilinx) ® UltraScale MPSoC architecture). Processing System (PS) and Xilinx Programmable Logic (PL) UltraScale architecture. In addition, it also includes on-chip memory, multi port external memory interfaces, and rich peripheral connection interfaces.
  • LT3754IUH#PBF

    LT3754IUH#PBF

    LT3754IUH#PBF is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • BCM88660A0KFSBLG

    BCM88660A0KFSBLG

    BCM88660A0KFSBLG is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • Megtron7 PCB

    Megtron7 PCB

    Megtron7 PCB--Panasonic automotive and Industrial Systems Corporation announced on May 28, 2014 that it has developed a low loss multilayer substrate material "Megtron 7" for high-end servers, routers and supercomputers with large capacity and high-speed transmission. The relative permittivity of the product is 3.3 (at 1GHz) and the dielectric loss tangent is 0.001 (at 1GHz). Compared with the original product "Megtron 6", the transmission loss is reduced by 20%.
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