PCBA processing Manufacturers

Our company insists all along the quality policy of "product good quality is base of enterprise survival; buyer fulfillment will be the staring point and ending of an company; persistent improvement is eternal pursuit of staff" and also the consistent purpose of "reputation very first, shopper first" for PCBA processing,Industrial control PCBA,PCBA,SMT processing,SMT welding, Customers' benefit and satisfaction are always our biggest goal. Please contact us. Give us a chance, give you a surprise.
PCBA processing, We take measure at any price to attain essentially the most up-to-date gear and procedures. The packing of nominated brand is our a further distinguishing feature. The solutions to assure years of trouble-free service has attracted a great deal customers. The items are obtainable in improved designs and richer variety, they're produced scientifically of purely raw supplies. It accessible in a variety of designs and specs for the selection. The newest forms are much far better than the previous one and they're extremely popular with several clients.

Hot Products

  • Heavy copper PCB

    Heavy copper PCB

    Printed circuit boards are usually bonded with a layer of copper foil on glass epoxy substrate. The thickness of copper foil is usually 18 μ m, 35 μ m, 55 μ m and 70 μ M. The most commonly used copper foil thickness is 35 μ M. When the weight of copper is more than 70UM, it is called heavy copper PCB
  • XC3S1400AN-4FGG676C

    XC3S1400AN-4FGG676C

    XC3S1400AN-4FGG676C is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • EP3C120F780I7N

    EP3C120F780I7N

    EP3C120F780I7N is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC7Z045-1FBG676I

    XC7Z045-1FBG676I

    XC7Z045-1FBG676I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • 5CSEBA4U23I7N

    5CSEBA4U23I7N

    ​5CSEBA4U23I7N is a SoC FPGA (Field Programmable Gate Array) produced by Altera, which has high performance and rich functional features. Here is a detailed introduction about 5CSEBA4U23I7N:
  • XC95144XL-10TQG100C

    XC95144XL-10TQG100C

    XC95144XL-10TQG100C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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