S1600 PCB Manufacturers

"Based on domestic market and expand abroad business" is our improvement strategy for S1600 PCB,TG250 PCB,SH260 PCB,High heat resistant PCB,S2600F PCB, Now we have established steady and long business relationships with customers from North America, Western Europe, Africa, South America, more than 60 countries and regions.
S1600 PCB, We honor ourselves as a company that comprises of a strong team of professionals who are innovative and well experienced in the international trading, business development and product advancement. Moreover, the company stays unique among its competitors due to its superior standard of quality in production, and its efficiency and flexibility in business support.

Hot Products

  • XC5VSX95T-1FFG1136I

    XC5VSX95T-1FFG1136I

    ​XC5VSX95T-1FFG1136I is a high-performance FPGA (Field Programmable Gate Array) chip produced by Xilinx, belonging to the Virtex-5 SXT series
  • XC7Z045-2FFG676E

    XC7Z045-2FFG676E

    ​XC7Z045-2FFG676E is a high-performance FPGA chip launched by Xilinx, which has the characteristics of high-speed processing capability, low power consumption, and high integration, and is suitable for various applications in modern communication systems. This chip is based on the ARM Cortex-A9 core
  • XC7A75T-L2FGG484E

    XC7A75T-L2FGG484E

    XC7A75T-L2FGG484E is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.
  • XC3S4000-4FG676C

    XC3S4000-4FG676C

    XC3S4000-4FG676C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC6SLX45-2CSG484C

    XC6SLX45-2CSG484C

    XC6SLX45-2CSG484C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • EP2AGX95EF29I3G

    EP2AGX95EF29I3G

    EP2AGX95EF29I3G is a low-cost field-programmable gate array (FPGA) developed by Intel Corporation, a leading semiconductor technology company. This device features 120,000 logic elements and 414 user input/output pins, making it suitable for a wide range of low-power and low-cost applications. It operates on a single power supply voltage ranging from 1.14V to 1.26V and supports various I/O standards such as LVCMOS, LVDS, and PCIe. The device has a maximum operating frequency of up to 415 MHz. The device comes in a small fine pitch ball grid array (FGBA) package with 484 pins, providing high pin-count connectivity for a variety of applications.

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