S1600 PCB Manufacturers

"Based on domestic market and expand abroad business" is our improvement strategy for S1600 PCB,TG250 PCB,SH260 PCB,High heat resistant PCB,S2600F PCB, Now we have established steady and long business relationships with customers from North America, Western Europe, Africa, South America, more than 60 countries and regions.
S1600 PCB, We honor ourselves as a company that comprises of a strong team of professionals who are innovative and well experienced in the international trading, business development and product advancement. Moreover, the company stays unique among its competitors due to its superior standard of quality in production, and its efficiency and flexibility in business support.

Hot Products

  • XC6SLX9-3CSG324C

    XC6SLX9-3CSG324C

    XC6SLX9-3CSG324C is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.
  • XC7VX690T-2FFG1926I

    XC7VX690T-2FFG1926I

    XC7VX690T-2FFG1926I Field Programmable Gate Array (FPGA) is a device that utilizes stacked silicon interconnect (SSI) technology and can meet the system requirements of various applications. FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnect system. Virtex-7 is suitable for applications such as 10G to 100G networks, portable radar, and ASIC prototype design.
  • XCZU67DR-2FFVE1156I

    XCZU67DR-2FFVE1156I

    XCZU67DR-2FFVE1156I is one of the Zynq UltraScale+RFSoC series products produced by AMD/Xilinx
  • RF-35TC PCB

    RF-35TC PCB

    Rf-35TC PCB is Taconic high thermal conductivity low loss laminate, high Tc, DK 3.5 substrate, DF 0.0011, is a good choice for high frequency, radio frequency, Microwave PCB
  • XC7S50-2CSGA324I

    XC7S50-2CSGA324I

    ​XC7S50-2CSGA324I is an FPGA (Field Programmable Gate Array) launched by AMD/Xilinx, with the following features and specifications: Packaging form: CSPBGA-324 packaging is adopted, which is a surface mount packaging suitable for high-density integrated circuits
  • XC2VP20-6FF1152I

    XC2VP20-6FF1152I

    XC2VP20-6FF1152I is suitable for use in a variety of applications, including industrial control, telecommunications, and automotive systems. The device is known for its easy-to-use interface, high efficiency, and thermal performance, making it an ideal choice for a wide range of power management applications.

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